Method for manufacturing light emitting diode package

A method for manufacturing a light emitting diode (LED) package, comprising following steps:

• providing a eutectic bonding apparatus, and the eutectic bonding apparatus comprising a heating device, a supporting platform located in the heating device, and a nozzle;
• providing a resistance measuring device, and the resistance measuring device comprising a probe accommodating in the nozzle, an electrical power, and a controlling unit;
• providing at least an LED chip, and the LED chip having two opposite electrodes formed on top and bottom ends thereof, respectively;
• providing a substrate and positioning the substrate on the supporting platform of the eutectic bonding apparatus;
• moving the nozzle to catch the LED chip onto the substrate, and the nozzle pressing the LED chip against the substrate;
• and
• heating the substrate and the LED chip to above a predetermined temperature, to form a eutectic bonding process between the LED chip and the substrate;
• wherein the probe of the resistance measuring device is electrically connected to the electrode, a total resistance of the LED chip and the substrate is measured by the resistance measuring device in real-time, when the total resistance is equal to a predetermined value, the heating device is ordered to stop heating by the controlling unit of the resistance measuring device.