Method for Detecting Defects During a Laser-Machining Process and Laser-Machining Device
AssigneeTRUMPF Laser- und Systemtechnik GmbH
InventorsDieter Pfitzner, Holger Braun, Friedhelm Dorsch
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AssigneeTRUMPF Laser- und Systemtechnik GmbH
InventorsDieter Pfitzner, Holger Braun, Friedhelm Dorsch
Estimating the term…
Detection of defects during a machining process includes: moving a laser beam along a predefined path over multiple workpieces to be machined so as to generate a weld seam or a cutting gap in the workpieces; detecting, in a two-dimensional spatially resolved detector field of a detector, radiation emitted and/or reflected by the multiple workpieces; selecting at least one detection field section in the detection field of the detector based on laser beam control data defining movement of the laser beam along the predefined path or based on a previously determined actual-position data of the laser beam along the predefined path, wherein each detection field section comprises a region encompassing less than the entire detection field; evaluating the radiation detected in in the selected detection field section; and determining whether a defect exists at the weld seam or the cutting gap based on the evaluated radiation.
1-12. (canceled)
A method for detecting defects during a machining process, the method comprising:
A laser-machining device comprising:
Dependencies are inferred from the claim text.