Method of manufacturing a printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsWatanabe RYOICHI, Se Won Park
Life of this patent
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Abstract
A method of manufacturing a printed circuit board, according to one embodiment, includes forming a circuit pattern and a via pad, which is disposed by being spaced apart from the circuit pattern and has concavo-convex patterns, on a first insulating layer; forming a second insulating layer on the circuit pattern and the via pad having the concavo-convex patterns formed thereon; forming a via hole by etching a portion of the second insulating layer on the via pad; and forming a copper foil layer on the second insulating layer having the via hole formed therein.
Claims12
A method of manufacturing a printed circuit board comprising:
- forming a circuit pattern and a via pad, which is disposed by being spaced apart from the circuit pattern and has concavo-convex patterns, on a first insulating layer;
- forming a second insulating layer on the circuit pattern and the via pad having the concavo-convex patterns formed thereon;
- forming a via hole by etching a portion of the second insulating layer on the via pad;
- and
- forming a copper foil layer on the second insulating layer having the via hole formed therein.
A method of manufacturing a printed circuit board comprising:
- forming a circuit pattern by etching a portion of a first insulating layer and forming a via pad with concavo-convex patterns by etching a portion of the first insulating layer spaced apart from the circuit pattern;
- forming a second insulating layer on the circuit pattern and the via pad having the concavo-convex patterns formed thereon;
- forming a via hole by etching a portion of the second insulating layer on the via pad;
- and
- forming a copper foil layer on the second insulating layer having the via hole formed therein.
Dependencies are inferred from the claim text.