Copper electroplating solution and method of copper electroplating
AssigneeRohm and Haas Electronic Materials LLC
InventorsMatsuko Saito, Makoto Sakai, Shinjiro Hayashi
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Abstract
A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating.
Claims6
A copper plating solution which contains compounds with the structure —X—S—Y— wherein X and Y are independently atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes.
Dependencies are inferred from the claim text.