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US 2014/0174936 A1Published application
Plating of copper on semiconductors
AssigneeRohm and Haas Electronic Materials LLC
InventorsGary Hamm, Jason A. Reese, Lingyun Wei
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Abstract
Monovalent copper plating baths are used to metallize current tracks of the front side or emitter side of semiconductor wafers. Copper is selectively deposited on the current tracks by electrolytic plating or LIP. Additional metallization of the current tracks may be done using conventional metal plating baths. The metalized semiconductors may be used in the manufacture of photovoltaic devices.
Claims9
A method comprising:
- a) providing a semiconductor comprising a front side, a back side, and a PN junction, the front side comprises a pattern of conductive tracks comprising an underlayer and the back side includes metal contacts;
- b) contacting the semiconductor with a monovalent copper plating composition;
- and
- c) plating a copper layer on the underlayer of the conductive tracks.
1 more element
Dependencies are inferred from the claim text.