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AssigneeJX Nippon Mining & Metals Corporation
InventorShiro Tsukamoto
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The present invention relates to a method for recycling a tantalum coil for sputtering that is disposed between a substrate and a sputtering target. The method for recycling a tantalum coil for sputtering is characterized in that the whole or partial surface of a spent tantalum coil is subject to cutting (cutting is performed until a re-deposited film and knurling traces are eliminated) so as to eliminate the re-deposited film that was formed during sputtering, and knurling is newly performed to the cut portion. While sputtered grains are accumulated (re-deposited) on the surface of the tantalum coil disposed between the substrate and the sputtering target during sputtering, by eliminating the sputtered grains accumulated on the spent coil by way of cutting after the sputtering is complete, the tantalum coil can be efficiently recycled. Thus, provided is technology capable of lean manufacturing of new coils, improving productivity, and stably providing such coils.
A method for recycling a tantalum coil for sputtering that is disposed between a substrate and a sputtering target, wherein the surface of a spent tantalum coil is wholly or partially cut until irregularities of a re-deposited film or an erosion part and knurling traces are eliminated and a smooth surface is obtainied, the re-deposited film formed during sputtering is thereby eliminated, and thereafter knurling is newly performed to the cut portion.
Dependencies are inferred from the claim text.