Method for sleeve retaining a solder material onto a terminal unit
AssigneeChief Land Electronic Co., Ltd.
InventorsCHUNG-NAN PAO, SUN WU CHOU
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Abstract
The present disclosure relates to a method of sleeve retaining a solder material onto a terminal unit comprises of steps. In order to achieve the steps, a structure is also disclosed which comprises: a terminal unit and a solder material wherein the terminal unit possess a fixing portion while the solder material forms a sleeve which corresponds to the terminal unit, therefore enabling the sleeve retaining of the solder material. By means of sleevingly retain as described above, the assembly of the terminal unit and the solder material can be further stabilized.
Claims10
A method for sleeve retaining a solder material onto a terminal unit comprising:
- a) providing a generally elongated terminal unit having a fixing portion formed toward one end thereof;
- b) providing a solder material processed to form a pre-processed sleeve structure adapted to envelop a corresponding end of the terminal unit to form a gap between the pre-processed sleeve structure and the terminal unit;
- c) applying an external force to the pre-processed sleeve structure enveloping the terminal unit to cause local deformation thereof, and thereby causing the solder material to retain onto the fixing portion of the terminal unit.
A solder material and an electrical connector terminal unit combination structure, comprising:
- a generally elongated terminal unit having a fixing portion formed toward one end thereof;
- and
- a solder material processed to form a pre-processed sleeve structure adapted to sleevingly couple to the fixing portion of the terminal unit.
Dependencies are inferred from the claim text.