Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorYoung Soon KIM
Life of this patent
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Abstract
Disclosed herein are a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board according to an exemplary embodiment of the present invention includes forming an insulating layer for a circuit pattern protection on a base substrate having a predetermined circuit pattern on at least one surface thereof; removing a part of the insulating layer to form an opened region having a predetermined pattern; applying copper particles onto the insulating layer including the opened region and then irradiating laser on a portion corresponding to the opened region; and fusing the copper particles applied onto the opened region by the laser irradiation to one another to form a copper post on the opened region.
Claims9
A printed circuit board, comprising:
- a base substrate having a predetermined circuit pattern on at least one surface thereof;
- an insulating layer formed on the base substrate and protecting the circuit pattern;
- and
- a bump formed on the base substrate and electrically connecting electronic components mounted on the base substrate to the circuit pattern,
- wherein the bump has an overall appearance of a vertical post shape and is formed so that a part of a body thereof is buried in the insulating layer.
A manufacturing method of a printed circuit board, the method comprising:
- forming an insulating layer for a circuit pattern protection on a base substrate having a predetermined circuit pattern on at least one surface thereof;
- removing a part of the insulating layer to form an opened region having a predetermined pattern;
- applying copper particles onto the insulating layer including the opened region and then irradiating laser on a portion corresponding to the opened region;
- and
- fusing the copper particles applied onto the opened region by the laser irradiation to one another to form a copper post on the opened region.
Dependencies are inferred from the claim text.