Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Hyun Noh, Dong Uk Lee, Young Gon Kim
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Abstract
Disclosed herein are a printed circuit board (PCB) and a method of manufacturing the same. The PCB includes a core layer, metal bumps embedded in the core layer, one surface of the metal bumps being opened to the outside, and a solder resist layer including an opening is manufactured by a separating substrate manufacture method. In the PCB, empty space between the bumps is filled with an insulating material instead of solder resist, and thus, a problem in terms of an empty space between bumps is addressed without requiring a new solder resist process.
Claims11
A printed circuit board (PCB), comprising:
- a core layer;
- metal bumps embedded in the core layer, one surface of the metal bumps being exposed to the outside;
- and
- a solder resist layer formed on the core layer and including an opening for exposing the metal bumps therethrough.
A method of manufacturing a printed circuit board (PCB), the method comprising:
- preparing a substrate core;
- forming a first circuit layer including metal bumps on the substrate core;
- stacking a core layer on the first circuit layer;
- forming a hole in the core layer and forming a second circuit layer connected to the first circuit layer;
- and
- coating solder resist on the second circuit layer.
Dependencies are inferred from the claim text.