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US 2014/0174809 A1Published application
Circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Wook PARK, Jae Kul Lee, Jin Gu Kim, Chang Bae Lee
Life of this patent
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Abstract
Disclosed herein is a circuit board including: a core layer including a via hole; a metal film covering an inner wall of the via hole; a circuit pattern connected to the metal film on the core layer; and a plug surrounded by the metal film in the via hole and having a thickness thinner than a thickness of the core layer.
Claims12
A circuit board comprising:
- a core layer including a via hole;
- a metal film covering an inner wall of the via hole;
- a circuit pattern connected to the metal film on the core layer;
- and
- a plug surrounded by the metal film in the via hole and having a thickness thinner than a thickness of the core layer.
2 more elements
A method of manufacturing a circuit board, the method comprising:
- forming a core layer including a via hole;
- forming a circuit structure covering an inner wall of the via hole and the core layer;
- forming an insulation film filled in the via hole and covering the core layer on the core layer;
- and
- etching the insulation film such that a thickness of the insulation film filled in the via hole is thinner than a thickness of the core layer.
2 more elements
Dependencies are inferred from the claim text.