Reduced capacitance land pad
AssigneeIntel Corporation
InventorsZhichao Zhang, Tao Wu, Gaurav Chawla, Jeffrey Lee
Life of this patent
Estimating the term…
Abstract
A land grid array (LGA) land pad having reduced capacitance is disclosed. The conductive portion of a land pad that overlaps a parallel ground plane within the substrate is reduced by one or more non-conductive voids though the thickness of the conductive portion of the land pad. The voids may allow the contact area of the land pad, as defined by the perimeter of the land pad, to remain the same while reducing the conductive portion that overlaps the parallel ground plane. Capacitance between the land pad and the parallel ground plane is reduced by an amount proportional to the reduction in overlapping conductive area.
Claims26
A land pad, comprising:
- a conductive portion having a contact area and a thickness;
- and
- one or more non-conductive voids extending through the thickness of the conductive portion.
A structure, comprising:
- a substrate having one or more dielectric layers including a conductive trace and a ground plane;
- and
- a plurality of land pads on the surface of the substrate, the land pads each comprising:
- a conductive portion electrically coupled with the conductive trace by one or more vias, the conductive portion having a contact area and a thickness, wherein the contact area is parallel to the ground plane;
- and
- one or more non-conductive voids extending through the thickness of the conductive portion.
A method for forming a land pad, comprising:
- forming a contact via through at least one outer dielectric layer of a substrate, wherein the contact via exposes a conductive trace within the substrate;
- electrolessly plating a seed layer over the outer dielectric layer and contact via;
- forming a patterning layer to define a pattern exposing portions of the seed layer;
- electroplating a conductive material onto exposed portions of the seed layer;
- and
- removing the patterning layer and portions of the seed layer underlying the patterning layer to form a land pad, the land pad comprising:
- a conductive portion having a contact area and a thickness;
- and
- one or more non-conductive voids extending through the thickness of the conductive portion.
Dependencies are inferred from the claim text.