High density organic bridge device and method
AssigneeIntel Corporation
InventorsMihir K. Roy, Stephanie M. Lotz, Wei-Lun Kane Jen
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Abstract
Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.
Claims20
A microelectronic package comprising;
- an organic polymer substrate;
- an organic polymer bridge embedded in the substrate;
- a first interconnect structure at a first location of the organic polymer bridge and a second interconnect structure at a second location of the organic polymer bridge;
- and
- an electrically conductive path in the organic polymer bridge connecting the first interconnect structure to the second interconnect structure.
An organic bridge adapted to interconnect a plurality of die, the organic bridge comprising:
- a metal routing layer;
- a metal pad layer;
- interleaved organic polymer dielectric layers;
- and
- wherein there is no layer made substantially of silicon.
A microelectronic package comprising:
- an organic polymer package substrate;
- and
- an organic polymer bridge comprising a metal pad layer, a metal routing layer and interleaved dielectric layers, the organic polymer bridge being embedded in the organic polymer package substrate.
A method comprising:
- providing an organic bridge comprising:
- a metal routing layer;
- a metal pad layer;
- interleaved organic polymer dielectric layers;
- providing an organic package substrate having a recess formed therein;
- and
- bonding the organic bridge into the recess of the organic package using an organic polymer.
Dependencies are inferred from the claim text.