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US 2014/0174805 A1Published application
Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorTakayuki Haze
Life of this patent
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Abstract
Disclosed herein is a printed circuit board, including: a base substrate; a non-photosensitive insulating layer formed on the base substrate; a circuit pattern formed on the base substrate and having an upper portion protruded from an upper portion of the non-photosensitive insulating layer; and a dam made of a photosensitive material and formed on the upper portion of the non-photosensitive insulating layer of an outer side of the base substrate.
Claims14
A printed circuit board, comprising:
- a base substrate;
- a non-photosensitive insulating layer formed on the base substrate;
- a circuit pattern formed on the base substrate and having an upper portion protruded from an upper portion of the non-photosensitive insulating layer;
- and
- a dam made of a photosensitive material and formed on the upper portion of the non-photosensitive insulating layer of an outer side of the base substrate.
2 more elements
A method of manufacturing a printed circuit board, the method comprising:
- preparing a base substrate having a circuit pattern formed thereon;
- sequentially laminating a non-photosensitive insulating layer and a photosensitive insulating layer over the base substrate in order to cover the circuit pattern;
- and
- exposing an upper portion of the circuit pattern by partially removing the photosensitive insulating layer.
1 more element
Dependencies are inferred from the claim text.