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US 2014/0174801 A1Published application
Conductive material and process
AssigneeHenkel IP & Holding GmbH
InventorsBin Wei, Allison Yue Xiao
Life of this patent
Estimating the term…
Abstract
A conductive ink comprises nanosilver particles, and adhesion promoters, in which no binders, such as polymers or resins, are used in the compositions. In one embodiment the adhesion promoters are oxydianiline and 4,4-(1,3-phenylenedioxy)dianiline.
Claims9
A conductive ink comprising nanosilver particles and adhesion promoters, in the absence of polymeric and resin binders.
A conductive trace prepared by depositing a conductive ink onto a substrate and heating the ink to sinter the silver, the conductive ink comprising nanosilver particles and adhesion promoters.
Dependencies are inferred from the claim text.