Embedded multilayer ceramic electronic component and method of manufacturing the same, and printed circuit board having embedded multilayer ceramic electronic component

A method of manufacturing an embedded multilayer ceramic electronic component, the method comprising:

• preparing ceramic green sheets including dielectric layers;
• forming internal electrode patterns on the ceramic green sheets using a conductive paste for internal electrodes, containing a conductive metal powder and a ceramic powder;
• laminating the ceramic green sheets having the internal electrode patterns formed thereon, to thereby form a ceramic body including first internal electrodes and second internal electrodes facing each other;
• forming a first external electrode and a second external electrode on upper and lower surfaces and end parts of the ceramic body, the first and second external electrodes including a first conductive metal and glass;
• and
• forming a conductive paste layer of a second conductive metal on the first external electrode and the second external electrode.

A printed circuit board having an embedded multilayer ceramic electronic component, the printed circuit board comprising:

• an insulating substrate;
• and
• an embedded multilayer ceramic electronic component,
• the embedded multilayer ceramic electronic component including:
• a ceramic body including dielectric layers;
• first internal electrodes and second internal electrodes disposed to face each other with the dielectric layers interposed therebetween;
• a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes;
• and a conductive paste layer formed on the first external electrode and the second external electrode, wherein the first and second external electrodes include a first conductive metal and glass, and the conductive paste layers include a second conductive metal.