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US 2014/0174797 A1Published application
Build-up film structure, circuit board manufactured using the same, and method for manufacturing circuit board using the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJi Hye SHIM, Hwa Young Lee
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Abstract
Disclosed herein is a build-up film structure including: a core layer containing a resin and an inorganic filler; a first adhesive layer covering one surface of the core layer and having a smaller content of the inorganic filler than that of the core layer; and a second adhesive layer covering the other surface of the core layer and having a smaller content of the inorganic filler than that of the core layer.
Claims8
A build-up film structure comprising:
- a core layer containing a resin and an inorganic filler;
- a first adhesive layer covering one surface of the core layer and having a smaller content of the inorganic filler than that of the core layer;
- and
- a second adhesive layer covering the other surface of the core layer and having a smaller content of the inorganic filler than that of the core layer.
1 more element
A circuit board comprising:
- a board provided with a circuit pattern;
- an insulating film adhered to the board;
- and
- a plating pattern formed on the insulating film,
- wherein the insulating film includes a core layer containing a resin and an inorganic filler;
- a first adhesive layer covering one surface of the core layer and having a smaller content of the inorganic filler than that of the core layer;
- and a second adhesive layer covering the other surface of the core layer and having a smaller content of the inorganic filler than that of the core layer.
4 more elements
A method for a circuit board comprising:
- preparing a build-up film structure including a core layer containing a resin and an inorganic filler;
- a first adhesive layer covering one surface of the core layer and having a smaller content of the inorganic filler than that of the core layer;
- and a second adhesive layer covering the other surface of the core layer and having a smaller content of the inorganic filler than that of the core layer;
- separating a carrier film from the build-up film structure so that the first adhesive layer is exposed;
- adhering the exposed first adhesive layer to a board for manufacturing a build-up printed circuit board;
- separating a cover film from the build-up film structure so that the second adhesive layer is exposed;
- performing a desmear process on the second adhesive layer to allow the second adhesive layer to have a surface roughness;
- and
- forming a plating pattern on the second adhesive layer with the roughness.
6 more elements
Dependencies are inferred from the claim text.