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US 2014/0174793 A1Published application
Printed circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChang Gun Oh, Ho Sik Park, Hwa Sub Oh
Life of this patent
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Abstract
Disclosed herein are a printed circuit board and a method for manfuacturing the same, the printed circuit board including: a base substrate having circuit patterns; and heat radiating vias having a donut shape, formed in the base substrate, so that the heat radiation efficiency may be improved by increasing the area of the heat radiating via.
Claims14
A printed circuit board, comprising:
- a base substrate having circuit patterns;
- and
- heat radiating vias having a donut shape, formed in the base substrate.
A method for manufacturing a printed circuit board, the method comprising:
- preparing a base substrate having circuit patterns;
- and
- forming heat radiating vias having a donut shape in the base substrate.
Dependencies are inferred from the claim text.