Insulating film for printed circuit board having improved thermal conductivity, manufacturing method thereof, and printed circuit board using the same

#This application claims the benefit of Korean Patent Application No. 10-2012-0152064, filed Dec. 24, 2012, entitled “Insulating film for printed circuit board having improved thermal conductivity, producing method thereof, and printed circuit board using the same,” which is hereby incorporated by reference in its entirety into this application.

#1. Technical Field

#The present invention relates to an insulating film for a printed circuit board having improved thermal conductivity, a manufacturing method thereof, and a printed circuit board using the same.

#The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description when taken in conjunction with the accompanying drawings, in which:

#FIG. 1 is a cross-sectional view illustrating a typical printed circuit board to which an insulating film according to the present invention may be applied; and

#FIG. 2 is a flowchart illustrating a process of manufacturing the insulating film according to the present invention.

#Before the present invention is described in more detail, the terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept implied by the term to best describe the method he or she knows for carrying out the invention. It is noted that, the embodiments of the present invention are merely illustrative, and are not construed to limit the scope of the present invention, and thus there may be a variety of equivalents and modifications able to substitute for them at the point of time of the present application.

#In the following description, it is to be noted that embodiments of the present invention are described in detail so that the present invention may be easily performed by those skilled in the art, and also that, when known techniques related with the present invention may make the gist of the present invention unclear, a detailed description thereof will be omitted.

#FIG. 1 is a cross-sectional view illustrating a typical printed circuit board to which a resin composition according to the present invention may be applied. As illustrated in FIG. 1, a printed circuit board 100 may be an embedded board including electronic parts therein. Specifically, the printed circuit board 100 may include an insulator or prepreg 110 having a cavity, an electronic part 120 provided in the cavity, and build-up layers 130 formed on one or more of the upper and lower surfaces of the insulator or prepreg 110 including the electronic part 120. The build-up layers 130 may include insulating layers 131 formed on one or more of the upper and lower surfaces of the insulator 110, and circuit layers 132 which are formed on the insulating layers 131 and may achieve interlayer connection.