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US 2014/0174790 A1Published application
Wiring substrate
AssigneeYazaki Corporation
InventorMamoru SAWAI
Life of this patent
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Abstract
A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.
Claims4
A wiring substrate, comprising:
- a wiring board that has a main face and a side face substantially perpendicular to the main face;
- a circuit pattern that is formed on the main face of the wiring board;
- a soaking plate that is disposed in an intermediate layer of the wiring board;
- and
- a plurality of protruding terminals that are disposed in the intermediate layer and are projected outwardly from the side face,
- wherein the protruding terminals are electrically connected in the intermediate layer to each other.
3 more elements
Dependencies are inferred from the claim text.