Plasma stabilization method and plasma apparatus

A plasma processing system, comprising:

• a processing chamber operable to process an object disposed within the processing chamber;
• a surrounding member disposed so as to surround the processing chamber, the surrounding member including a top surface, a side surface, and a bottom surface that create an inner space, the top surface being a dielectric member sealing an opening on top of the processing chamber;
• an RF generator;
• a matching network connected to the RF generator;
• an RF induction coil connected to the matching network and disposed above the top surface;
• a direct-current magnetic field generator for supplying a direct-current magnetic field to the inner space;
• and
• an RF cut filter connected in parallel to the RF induction coil and the matching network, the RF cut filter connected to a direct current (DC) power supply and connected to the direct-current magnetic field generator, the RF cut filter including a first capacitor connected to a positive terminal of the DC power supply and to ground, a second capacitor connected to a negative terminal of the DC power supply and to ground, and a third capacitor connected to the positive terminal and to the negative terminal of the DC power supply.