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US 2014/0174655 A1Published application
Polishing tool with diaphram for uniform polishing of a wafer
AssigneeHGST Netherlands B.V.
InventorsSergey Grinberg, David A. Hansen, Tom K. Harris, III, Junsheng Yang, Honglin Zhu
Life of this patent
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Abstract
A chemical mechanical polishing to that can provide uniform polishing across a wafer even when polishing hard wafers such as AlTiC wafers used in the formation of magnetic recording sliders. The chemical mechanical polishing to has a wafer carrier that includes a diaphragm or bladder that is configured such that an inner portion of the bladder can be pneumatically pressurized so as to bow outward, while outer portions remain unpressurized.
Claims21
A wafer carrier, comprising:
- a bladder having an inner portion and an outer portion;
- and
- a pneumatic supply configured for pressurizing the inner portion of the bladder without pressurizing an outer portion of the bladder.
A chemical mechanical polishing tool, comprising:
- a wafer carrier that includes a bladder having an inner portion and an outer portion, and a pneumatic supply configured for pressurizing the inner portion of the bladder without pressurizing an outer portion of the bladder;
- a polishing pad configured for movement over a surface of the wafer carrier;
- and
- a slurry supply configured to supply a slurry over the surface of the wafer carrier.
1 more element
Dependencies are inferred from the claim text.