Self-Aligning Pick-up Head and Method for Manufacturing a Device with the Self-Aligning Pick-up Head
AssigneeInfineon Technologies AG
InventorsHorst Groeninger, Konrad Roesl
Life of this patent
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Abstract
A self-aligning pick-up head, a method to manufacture a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a nozzle having a first end portion and a second end portion and a base tool comprising a collet head, wherein the first end portion of the nozzle is gimbaled to the base tool.
Claims20
A pick-up head comprising:
- a nozzle comprising a first end portion and a second end portion;
- and
- a base tool comprising a collet head,
- wherein the first end portion of the nozzle is gimbaled to the base tool.
The pick-up head according to clam 1, wherein the nozzle and the base tool and the collet head comprise a vacuum path.
A pick-up head comprising:
- a base tool comprising:
- a first main surface;
- a second main surface;
- and
- a recess with at least a portion of a spherical surface;
- and
- a nozzle comprising a first end portion having at least a portion of a spherical surface and a second end portion;
- and
- a cover mounted on the first main surface of the base tool,
- wherein the portion of the spherical surface of the nozzle is placed on the portion of the spherical surface of the recess, and wherein the second end portion of the nozzle is movable relative to the base tool.
A method for manufacturing a self-aligning pick-up head, the method comprising:
- placing at least on pin in a spherical end portion of a nozzle;
- and
- connecting the nozzle to a base tool by mounting a cover on a first main surface of the base tool such that the nozzle is gimbaled to the base tool.
A method for manufacturing a device, the method comprising:
- picking-up a die with a self-aligning pick-up head;
- placing the die on a die carrier;
- bonding the die to the die carrier;
- and
- encapsulating the die.
Dependencies are inferred from the claim text.