Method for manufacturing light emitting diode module

A method for manufacturing a light emitting diode (LED) module, comprising following steps:

• providing a SMT (Surface Mount Technology) apparatus having a CCD (Charge-Coupled Device) image sensor and a nozzle, and providing a PCB having a plurality of LEDs mounted on and fixing the PCB in the SMT apparatus;
• providing a plurality of lenses each having a plurality of patterned portions formed on an outer face of the lens;
• providing an adhesive area in the SMT apparatus, disposing a plurality of adhesive on the adhesive area, and the nozzle carrying each lens to the adhesive area for adhering adhesive to a bottom of the lens;
• carrying each lens by the nozzle upwardly from the adhesive area, and the CCD image sensor imaging the lens and identifying the patterned portions, and then the SMT apparatus obtaining a location of the lens relative to a corresponding LED;
• and
• positioning and fixing the lenses on the PCB to cover the LEDs by the SMT apparatus.