Solder powder, and solder paste using solder powder
AssigneeMitsubishi Materials Corporation
InventorsSho Nakagawa, Hiroki Muraoka, Kanji Kuba, Yousuke Kawamura
Life of this patent
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Abstract
In solder powder having an average particle size of 5 μm or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.
Claims5
A solder powder having an average particle size of 5 μm or less and having a center core and a covering layer covering the center core, wherein
- the center core consists of an intermetallic compound of silver and tin, or silver and an intermetallic compound of silver and tin,
- the covering layer consist of tin, and
- an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.
Dependencies are inferred from the claim text.