Metal-foil-assisted fabrication of thin-silicon solar cell
AssigneeSunPower Corporation
InventorsSeung Bum RIM, Gabriel HARLEY
Life of this patent
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Abstract
One embodiment relates to a method of fabricating a solar cell. A silicon lamina is cleaved from the silicon substrate. The backside of the silicon lamina includes the P-type and N-type doped regions. A metal foil is attached to the backside of the silicon lamina. The metal foil may be used advantageously as a built-in carrier for handling the silicon lamina during processing of a frontside of the silicon lamina. Another embodiment relates to a solar cell that includes a silicon lamina having P-type and N-type doped regions on the backside. A metal foil is adhered to the backside of the lamina, and there are contacts formed between the metal foil and the doped regions. Other embodiments, aspects and features are also disclosed.
Claims22
A method of fabricating a solar cell, the method comprising:
- cleaving a silicon lamina from the silicon substrate, wherein a backside of the silicon lamina includes P-type and N-type doped regions;
- and
- attaching a metal foil to the backside of the silicon lamina.
(canceled)
A solar cell comprising:
- a silicon lamina;
- P-type and N-type doped regions on a backside of the silicon lamina;
- a metal foil adhered to the backside of the silicon lamina;
- a first set of contacts between the metal foil and the P-type doped regions;
- and
- a second set of contacts between the metal foil and the N-type doped regions.
A method of fabricating a solar cell, the method comprising:
- adhering a metal foil to a backside of a silicon substrate, wherein the backside of the silicon substrate includes P-type and N-type doped regions;
- separating a silicon lamina from the backside of the silicon substrate;
- and
- using the metal foil as a built-in carrier for handling the silicon lamina during processing of a frontside of the silicon lamina.
(canceled)
Dependencies are inferred from the claim text.