Processing and Cleaning Substrates
AssigneeIntermolecular, Inc.
InventorsSatbir Kahlon, Jeffrey Chih-Hou Lowe, Frank C. Ma, Sandeep Mariserla, Robert Anthony Sculac
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntermolecular, Inc.
InventorsSatbir Kahlon, Jeffrey Chih-Hou Lowe, Frank C. Ma, Sandeep Mariserla, Robert Anthony Sculac
Estimating the term…
The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.
A method, comprising the steps of:
Dependencies are inferred from the claim text.