Vapor deposition apparatus and method of manufacturing organic light-emitting display apparatus

A vapor deposition apparatus for forming a deposition layer on a substrate, the vapor deposition apparatus comprising:

• a plurality of first regions, each of the plurality of first regions including:
• a supply unit configured to receive a first source gas,
• a reaction space connected to the supply unit,
• a plasma generator in the reaction space,
• a first injection unit configured to inject a deposition source material to the substrate, the deposition source material including the first source gas, and
• a filament unit in the reaction space, the filament unit being connected to a power source;
• a plurality of second regions, each of the plurality of second regions being configured to inject a second source material being toward the substrate;
• and
• a plurality of purge parts, the plurality of purge parts being configured to inject a purge gas toward the substrate.

A deposition method for forming a deposition layer on a substrate, the method comprising:

• supplying a first source gas from a supply unit to a reaction space;
• generating plasma by using a plasma generator disposed in the reaction space;
• activating the first source gas in the reaction space by using a filament unit in the reaction space and connected to a power source, such that at least a portion of the first source gas in the reaction space is changed into a radical status;
• and
• injecting a first source deposition material to the substrate, the first source deposition material including the first source gas in the radical status.

A method of manufacturing an organic light-emitting display apparatus, the method comprising:

• disposing a substrate to correspond to a vapor deposition apparatus;
• and
• forming a thin film on the substrate, the thin film being at least one of a first electrode, an intermediate layer having an organic emission layer, a second electrode, and an encapsulation layer, and forming the thin film includes:
• supplying a first source gas from a supply unit to a reaction space,
• generating plasma by using a plasma generator disposed in the reaction space,
• activating the first source gas in the reaction space by using a filament unit that in the reaction space and connected to a power source, such that at least a portion of the first source gas in the reaction space is changed into a radical status, and
• injecting a first source deposition material to the substrate, the first source deposition material including the first source gas in the radical status.