Organic solderability preservative and method
AssigneeRohm and Haas Electronic Materials LLC
InventorsQin TANG, Kit Ho TONG, Chit Yiu CHAN, Martin W. BAYES
Life of this patent
Estimating the term…
Abstract
An organic solderability preservative solution includes pyrazine derivatives which inhibit corrosion of metal. The solution is applied to metal surfaces of components for electronic apparatus to improve solderability of electrical connections between the components in the electronic apparatus.
Claims5
Compositions comprise one or more sources of metal ions chosen from copper salts, tin salts, zinc salts, silver salts, nickel salts, lead salts, barium salts, manganese salts, iron salts and palladium salts, one or more acids and one or more compounds having formulae:
- wherein R1, R2 and R3 are independently hydrogen, halide, nitro, hydroxyl, cyano, substituted or unsubstituted, linear, branched or cyclic hydrocarbyl, substituted or unsubstituted, linear or branched alkoxyl, carboxyl, ester, mercapto, alkylthio, thioester, amino, amide, boryl or silyl;
- R1 and R2 may be taken together with all of their atoms to form a five membered heterocyclic ring wherein the heterocyclic ring includes two nitrogen atoms as the hetero-atoms;
- and R1 can have the following structure:
- wherein R4 and R5 are independently hydrogen, halide, nitro, hydroxyl, cyano, substituted or unsubstituted, linear, branched or cyclic hydrocarbyl, substituted or unsubstituted, linear or branched alkoxyl, carboxyl, ester, mercapto, alkylthio, thioester, amino, amide, boryl or silyl;
- R4 and R5 may be taken together with all of their atoms to form a five membered heterocyclic ring wherein the heterocyclic ring includes two nitrogen atoms as the hetero-atoms.
A method comprising:
- a) providing a substrate comprising copper or copper alloy;
- and
- b) contacting the substrate with a composition including one or more sources of metal ions chosen from copper salts, tin salts, zinc salts, silver salts, nickel salts, lead salts, barium salts, manganese salts, iron salts and palladium salts, one or more acids and one or more compounds having structure:
- wherein R1, R2 and R3 are independently hydrogen, halide, nitro, hydroxyl, cyano, substituted or unsubstituted, linear, branched or cyclic hydrocarbyl, substituted or unsubstituted, linear or branched alkoxyl, carboxyl, ester, mercapto, alkylthio, thioester, amino, amide, boryl or silyl;
- R2 and R3 may be taken together with all of their atoms to form a five membered heterocyclic ring wherein the heterocyclic ring includes two nitrogen atoms as the hetero-atoms;
- and R1 may have the following structure:
- wherein R4 and R5 are independently hydrogen, halide, nitro, hydroxyl, cyano, substituted or unsubstituted, linear, branched or cyclic hydrocarbyl, substituted or unsubstituted, linear or branched alkoxyl, carboxyl, ester, mercapto, alkylthio, thioester, amino, amide, boryl or silyl;
- R4 and R5 may be taken together with all of their atoms to form a five membered heterocyclic ring wherein the heterocyclic ring includes two nitrogen atoms as the hetero-atoms to form a coating on the copper or copper alloy of the substrate.
Dependencies are inferred from the claim text.