Microstructured hot stamping die
AssigneeHeraeus Sensor Technology GmbH
InventorsKarlheinz Wienand, Matsvei Zinkevich
Life of this patent
Estimating the term…
Abstract
A stamping die for hot stamping a material includes a profiled stamping surface, wherein the stamping die includes at least one thermally insulating substrate, on which an electrically conductive structure having a heating resistor is arranged, and wherein the electrically conductive structure is covered by an electrically insulating film. The surface of the electrically insulating film includes the profiled stamping surface and the electrically insulating film covers at least the heating resistor such that the electrically insulating film with the stamping surface can be electrically heated by the heating resistor. A method for hot stamping a material using such a stamping die includes heating the resistor to a temperature between 100° C. and 800° C.
Claims16
-15. (canceled)
A stamping die for hot stamping a material, comprising a profiled stamping surface (8, 18), wherein the stamping die (1, 11) comprises at least one thermally insulating substrate (2, 12), on which an electrically conductive structure (4, 5, 6, 14, 15) comprising a heating resistor (4, 14) is arranged, and in that the electrically conductive structure (4, 5, 6, 14, 15) is covered by an electrically insulating film (7, 17), wherein the surface of the electrically insulating film (7, 17) comprises the profiled stamping surface (8, 18) and the electrically insulating film (7, 17) covers at least the heating resistor (4, 14) such that the electrically insulating film (7, 17) with the stamping surface (8, 18) can be electrically heated by the heating resistor (4, 14), and wherein the thermally insulating substrate (2, 12) is an oxidic ceramic and/or a metal oxide and the thermally insulating substrate (2, 12) has a thermal conductivity less than 5 W/(m K).
Dependencies are inferred from the claim text.