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US 2014/0174257 A1Published application
Method for decomposing cured epoxy resin
AssigneePanasonic Corporation
InventorsHiroki Ohira, Shin Matsugi
Life of this patent
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Abstract
There is provided a method for decomposing a cured epoxy resin, the method being capable of decomposing a cured epoxy resin containing silica efficiently. A cured epoxy resin containing silica is decomposed by being brought into contact with subcritical water including at least one alkaline compound selected from an alkaline metal salt and an alkaline metal hydroxide.
Claims5
A method for recovering a metal from a metal-containing product that the metal is encapsulated with a cured epoxy resin containing silica,
- the method comprising:
- bringing the cured epoxy resin containing silica into contact with subcritical water to decompose the resin, the subcritical water including an alkaline metal hydroxide as an alkaline compound.
Dependencies are inferred from the claim text.