Method, apparatus and sample for evaluating bonding strength
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsGyu Seok KIM, Hee Suk CHUNG, Hyun Jung LEE, Suk-Jin HAM, Ju Wan NAM, Jin Uk CHA, Mi Yang KIM
Life of this patent
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Abstract
There are provided a method, an apparatus and a sample for evaluating bonding strength, the method including setting a micro-region including a bonded interface in an evaculated sample, forming a first groove in a circumferential portion of the micro-region to have a predetermined depth, processing a side of the micro-region to form a second groove connected to the bonded interface, and applying pressure on the micro-region to measure a critical point at which a delamination of the micro-region is generated.
Claims12
A method for evaluating bonding force, the method comprising:
- setting a micro-region including a bonded interface in an evaculated sample;
- forming a first groove in a circumferential portion of the micro-region to have a predetermined depth;
- processing a side of the micro-region to form a second groove connected to the bonded interface;
- and
- applying pressure on the micro-region to measure a critical point at which a delamination of the micro-region is generated.
An apparatus for evaluating bonding force, the apparatus comprising:
- an upper holder having a reference surface disposed to be parallel to one surface of an evaluated sample;
- a lower holder supporting the upper holder so as to maintain the reference surface horizontally;
- and
- a pressing tip applying pressure on the evaluated sample.
A sample for evaluating bonding force, the sample comprising:
- a micro-region including a bonded interface and formed by a first groove having a predetermined depth;
- and
- a protrusion part separated by a second groove extended from an end portion of the micro-region to the bonded interface.
Dependencies are inferred from the claim text.