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US 2014/0173926 A1Published application
System and method for removing oxide from a sensor clip assembly
AssigneeRaytheon Company
InventorsAndreas Hampp, Sean F. Harris, Talieh H. Sadighi, Bengi F. Hanyaloglu
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Abstract
According to embodiments of the present disclosure, a method for removing oxide includes placing a sensor chip assembly having an oxide layer formed on a portion thereof within an enclosed and controlled environment. The portion of the sensor chip assembly is exposed to a reactive gas and a UV light to result in a substantial removal of the oxide layer formed on the portion of the sensor chip assembly.
Claims7
A system for removing oxide comprising:
- a reactive chamber configured to provide an enclosed and controlled environment for receiving a sensor chip assembly;
- a first gas supply coupled to the reactive chamber, the first gas supply maintaining a supply of reactive gas;
- a UV lamp operable to generate UV light within the reactive chamber, and
- at least one controller in communication with the first gas supply and the UV light, the at least one controller operable to simultaneously expose the sensor chip assembly to the reactive gas and the UV light to result in the substantial removal of a layer of oxide formed on a portion of the sensor chip assembly.
1 more element
Dependencies are inferred from the claim text.