# US 2014/0155526 A1 · Polyimide composition varnish, film using the same, and method of manufacturing the polyimide composition varnish > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0155526 A1 - Document ID: US20140155526A1 - Status: Published application - Kind: A1 - Application number: 14/094,872 - Filed: 2013-12-03 - Published: 2014-06-05 - Earliest claimed: 2012-12-03 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: Fusaki FUJIBAYASHI - Web page: https://patentgrep.com/patent/US20140155526A1 ## CPC - C09D 7/62: modified by treatment with other compounds - C08J 3/215: at least one additive being also premixed with a liquid phase - C08J 5/18: Manufacture of films or sheets - C09D 179/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors - C08J 2379/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) ## Abstract A polyimide composition varnish, a film prepared from the same, and a method of manufacturing a polyimide composition varnish, the polyimide composition varnish including a polyimide or a polyimide precursor; and an organically modified layered silicate in which interlayer ions are replaced with organic phosphonium ions. ## Claims ### Claim 1 A polyimide composition varnish, comprising: a polyimide or a polyimide precursor; and an organically modified layered silicate in which interlayer ions are replaced with organic phosphonium ions. ### Claim 2 (depends on 1) The polyimide composition varnish as claimed in claim 1, further comprising an organic solvent, the organic solvent including at least one of γ-butyrolactone, N-methylpyrrolidone, or N, N-dimethylacetamide. ### Claim 3 (depends on 2) The polyimide composition varnish as claimed in claim 2, wherein a sum of amounts of the polyimide or the polyimide precursor and the organically modified layered silicate is in a range of 3 parts by weight to 40 parts by weight, based on a total weight of the polyimide composition varnish. ### Claim 4 (depends on 1) The polyimide composition varnish as claimed in claim 1, wherein the organically modified layered silicate is included in an amount of 1 part by weight to 100 parts by weight, based on 100 parts by weight of the polyimide or the polyimide precursor. ### Claim 5 (depends on 4) The polyimide composition varnish as claimed in claim 4, further comprising an organic solvent, the organic solvent including at least one of γ-butyrolactone, N-methylpyrrolidone, or N, N-dimethylacetamide. ### Claim 6 (depends on 5) The polyimide composition varnish as claimed in claim 5, wherein a sum of amounts of the polyimide or the polyimide precursor and the organically modified layered silicate is in a range of 3 parts by weight to 40 parts by weight, based on a total weight of the polyimide composition varnish. ### Claim 7 (depends on 1) A film prepared from the polyimide composition varnish as claimed in claim 1. ### Claim 8 (depends on 7) The film as claimed in claim 7, wherein: a light transmittance at 400 nm is 80% or more, a haze value is 5% or less, a linear thermal expansion coefficient at a temperature of 100° C. to 300° C. is 30 ppm/K or less, and a heating weight loss at 350° C. is 0.5% or less, based on an original weight measured at 150° C. ### Claim 9 A method of manufacturing a polyimide composition varnish, the method comprising: forming a dispersion by dispersing a layered silicate in water while heating; forming an organically modified layered silicate by adding organic phosphonium ions to the dispersion and stirring, removing a supernatant by separating a solid and a liquid, adding a mixed solution of water and ethanol and stirring, and removing a supernatant by separating a solid and a liquid; forming an organically modified layered silicate dispersion by adding an organic solvent to the organically modified layered silicate and stirring; and adding the organically modified layered silicate dispersion to a polyimide or a polyimide precursor and mixing. ### Claim 10 (depends on 9) The method as claimed in claim 9, wherein the organic solvent includes at least one of γ-butyrolactone, N-methylpyrrolidone, or N, N-dimethylacetamide. ### Claim 11 (depends on 9) The method as claimed in claim 9, wherein 1 part by weight to 100 parts by weight of the organically modified layered silicate is added and mixed, based on 100 parts by weight of the polyimide or the polyimide precursor. ### Claim 12 (depends on 11) The method as claimed in claim 11, wherein the organic solvent includes at least one of γ-butyrolactone, N-methylpyrrolidone, or N, N-dimethylacetamide. ### Claim 13 (depends on 9) The method as claimed in claim 9, wherein a sum of amounts of the polyimide or the polyimide precursor and the organically modified layered silicate is in a range of 3 parts by weight to 40 parts by weight, based on a total weight of the polyimide composition varnish.