# US 2014/0154956 A1 · Pad Conditioning and Wafer Retaining Ring and Manufacturing Method Thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0154956 A1 - Document ID: US20140154956A1 - Status: Published application - Kind: A1 - Application number: 14/093,164 - Filed: 2013-11-29 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: Ehwa Diamond Industrial Co., Ltd. - Applicants: Ehwa Diamond Industrial Co., Ltd. - Inventors: Seh Kwang LEE; Joo Han LEE; Kwan Hee PARK - Web page: https://patentgrep.com/patent/US20140154956A1 ## CPC - B24B 53/017: Devices or means for dressing, cleaning or otherwise conditioning lapping tools - B24B 37/32: Retaining rings - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract The present invention relates to a wafer retaining ring used in a chemical mechanical polishing process (CMP) for semiconductor device manufacturing, and in particular, to a pad conditioning and wafer retaining ring designed to prevent a wafer from slipping during the CMP process and, simultaneously condition a pad uniformly, and to a manufacturing method thereof. ## Claims ### Claim 1 A pad conditioning and wafer retaining ring for preventing a wafer from slipping during a chemical mechanical polishing (CMP) process, the pad conditioning and wafer retaining ring having a plurality of cutting tips, each cutting tip comprised of a plurality of protrusions, the plurality of cutting tips formed to be spaced at a predetermined distance from each other on the surface of the pad conditioning and wafer retaining ring to function as a pad conditioner. ### Claim 2 (depends on 1) The pad conditioning and wafer retaining ring of claim 1, wherein grooves having a predetermined width and depth are formed between the plurality of cutting tips formed on the surface of the pad conditioning and wafer retaining ring so as to extend from the outer circumference to the inner circumference of the pad conditioning and wafer retaining ring. ### Claim 3 (depends on 2) The pad conditioning and wafer retaining ring of claim 2, wherein the width of the grooves at the outer circumference is wider than that at the inner circumference. ### Claim 4 (depends on 1) The pad conditioning and wafer retaining ring of claim 1, wherein the pad conditioning and wafer retaining ring is formed of a reinforced polymer composite material, a super-hard alloy-based material, a ceramic material, or a combination thereof. ### Claim 5 (depends on 1) The pad conditioning and wafer retaining ring of claim 1, wherein the pad conditioning and wafer retaining ring further comprises a diamond coating layer formed on the surface of the plurality of protrusions. ### Claim 6 (depends on 1) The pad conditioning and wafer retaining ring of claim 1, wherein the side cross-sectional shape of the protrusions. ### Claim 7 (depends on 1) The pad conditioning and wafer retaining ring of claim 1, wherein the planar shape of the protrusions is polygonal, circular, or oval. ### Claim 8 (depends on 1) The pad conditioning and wafer retaining ring of claim 1, wherein the cutting tips comprise a plurality of protrusions formed at a predetermined distance from the inner circumference of the wafer retaining ring. ### Claim 9 A method for manufacturing a pad conditioning and wafer retaining ring, the method comprising: preparing a ring-shaped substrate having a determined thickness and width; forming on the surface of the ring-shaped substrate a plurality of grooves having a predetermined width and depth at a predetermined interval so as to extend from the outer circumference to the inner circumference of the ring-shaped substrate; and forming on the surface of the ring-shaped substrate between the plurality of grooves a plurality of cutting tips having a plurality of protrusions at a predetermined interval formed to be spaced at a predetermined distance from each other. ### Claim 10 (depends on 9) The method of claim 9, wherein the forming of the plurality of grooves is performed such that the width of the grooves at the outer circumference is wider than that at the inner circumference. ### Claim 11 (depends on 9) The method of claim 9, wherein the forming of the cutting tips is performed such that the side cross-sectional shape of the plurality of protrusions is polygonal. ### Claim 12 (depends on 9) The method of claim 9, wherein the forming of the cutting tips is performed such that the planar shape of the plurality of protrusions is polygonal, circular, or oval. ### Claim 13 (depends on 9) The method of claim 9, wherein the forming of the cutting tips is performed such that a plurality of protrusions is formed at a predetermined distance from the inner circumference of the ring-shaped substrate. ### Claim 14 (depends on 9) The method of claim 9, further comprising forming a diamond coating layer on the surface of the plurality of protrusions constituting the cutting tips. ### Claim 15 (depends on 1) A chemical mechanical polishing (CMP) system comprising the pad conditioning and wafer retaining ring of claim 1. ### Claim 16 (depends on 15) The CMP system of claim 15, wherein the CMP system has no separate conditioning means. ### Claim 17 (depends on 9) A CMP system comprising the pad conditioning and wafer retaining ring manufactured by the method of claim 9. ### Claim 18 (depends on 17) The CMP system of claim 17, wherein the CMP system further comprises no separate conditioning means.