# US 2014/0154953 A1 · Correcting current crowding in row bar and vias for single pad bonding > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0154953 A1 - Document ID: US20140154953A1 - Status: Published application - Kind: A1 - Application number: 13/690,694 - Filed: 2012-11-30 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: HGST Netherlands B.V. - Applicants: Hgst Netherlands B.V. - Inventors: David P. DRUIST; Glenn P. GEE; Edward H. LEE; David J. SEAGLE; Darrick T. SMITH - Web page: https://patentgrep.com/patent/US20140154953A1 ## CPC - B24B 37/005: Control means for lapping machines or devices - B24B 7/228: {for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065)} - G11B 5/00: Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor (G11B11/00 {and G11B13/00} take precedence) - G11B 5/3166: {Testing or indicating in relation thereto, e.g. before the fabrication is completed} - G11B 5/3169: {Working or finishing the interfacing surface of heads, e.g. lapping of heads} - G11B 5/3173: {Batch fabrication, i.e. producing a plurality of head structures in one batch} - H10W 72/90: Bond pads, in general - H10W 72/07554: {changes in dispositions} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/547: {Dispositions of multiple bond wires} - H10W 72/5522: {comprising gold [Au]} - H10W 72/5525: {comprising copper [Cu]} - H10W 72/59: Bond pads specially adapted therefor - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time. ## Claims ### Claim 1 A device, comprising: a row of sliders, each slider comprising: a magnetoresistive (MR) element deposited at an air bearing surface (ABS) of the slider; an electronic lapping guide (ELG) positioned at the ABS and electrically connected to a wafer, the ELG comprising a resistance and the wafer comprising an effective wafer resistance, wherein the resistance of the ELG is at least 50 times greater than the effective wafer resistance; and a bonding pad electrically connected to the ELG; end regions formed at one or more ends of the row; and at least two peripheral grounding vias, the vias being formed in the end regions and comprising a conductive material formed therein. ### Claim 2 (depends on 1) The device of claim 1, wherein the resistance of the ELG is at least 100 times greater than the effective wafer resistance. ### Claim 3 (depends on 1) The device of claim 1, wherein the ELG has a track width of between 20 um and 30 um. ### Claim 4 (depends on 1) The device of claim 1, further comprising a lapping controller, wherein the lapping controller is an alternating current lapping controller. ### Claim 5 (depends on 1) The device of claim 1, wherein the ELG has a cross-sectional area and wherein the cross sectional area of the ELG is decreased to increase the resistance of the ELG. ### Claim 6 A method, comprising: positioning a wafer in a lapping system with a lapping controller, the wafer comprising: a plurality of sliders; a magnetoresistive (MR) element deposited at an air bearing surface (ABS) of each slider; one or more electronic lapping guides (ELGs) positioned at the ABS and electrically connected to the wafer, wherein the ELGs correspond to at least one of the plurality of sliders; a bonding pad electrically connected to each of the one or more ELGs; and one or more peripheral grounding vias electrically connected to the wafer; connecting the lapping controller with the wafer at the bonding pad and the peripheral grounding vias; delivering a current to at least one of the ELGs through the bonding pad, wherein no more than 20% of the one or more ELGs in the wafer receive a current at one time, and wherein the bonding pads and the peripheral grounding vias are electrically connected through the wafer; detecting a resistance at the ELGs which receive a current; adjusting lapping based on the resistance detected at the ELGs which receive a current, wherein the lapping is adjusted based on the resistance of the corresponding ELGs; lapping the ELGs based on the resistance detected to achieve a specific stripe height; and repeating the steps of delivering the current, detecting the resistance, adjusting the lapping and lapping the ELGs until each of the ELGs is lapped to a specific stripe height. ### Claim 7 (depends on 6) The method of claim 6, wherein the current is delivered to no more than 15% of the ELGs at one time. ### Claim 8 (depends on 6) The method of claim 6, further comprising separating the sliders into at least 7 groups of sliders and the sliders only belong to one group at a time. ### Claim 9 (depends on 8) The method of claim 8, wherein the groups of sliders are positioned in a line proximate to one another. ### Claim 10 (depends on 8) The method of claim 8, wherein the groups of sliders are selected randomly from the sliders on the wafer. ### Claim 11 (depends on 8) The method of claim 8, further comprising lapping each group of sliders more than once. ### Claim 12 The method of 8, wherein the groups of sliders are reselected on subsequent lappings. ### Claim 13 (depends on 6) The method of claim 6, wherein one of the ELGs is used to adjust the lapping for more than one slider. ### Claim 14 (depends on 6) The method of claim 6, wherein delivering the current further comprises sequentially alternating the directionality of current delivered to the ELGs. ### Claim 15 A system for lapping a wafer, the wafer comprising: a plurality of sliders, each slider comprising: a magnetoresistive (MR) element deposited at an air bearing surface (ABS) of the slider; an electronic lapping guide (ELG) positioned at the ABS and electrically connected to the wafer; and a bonding pad electrically connected to the ELG, wherein the wafer has one or more peripheral grounding vias formed therein; and the system comprising: a lapping system comprising a lapping controller and configured to simultaneously lap an air bearing surface on the plurality of sliders, wherein the wafer is configured to be mounted on the lapping system; and the lapping controller electrically coupled to the bonding pads and the peripheral grounding vias, the lapping controller configured to sequentially provide a current to the ELGs in groups of no more than 20% of the attached ELGs, measure the resistance of the ELGs using the current path, and provide instructions to the lapping system based on the measured resistance, wherein the lapping controller is also configured to provide current, measure resistance and provide instructions to the lapping system until each slider is lapped by the lapping system to a desired stripe height. ### Claim 16 (depends on 15) The system of claim 15, wherein the lapping controller delivers the current to no more than 15% of the ELGs at one time. ### Claim 17 (depends on 15) The system of claim 15, wherein the lapping controller is configured to separate the sliders into at least 7 groups of sliders, wherein the sliders only belong to one group at a time. ### Claim 18 (depends on 17) The system of claim 17, wherein the lapping controller is configured to select the groups of sliders in a line proximate to one another. ### Claim 19 (depends on 17) The system of claim 17, wherein the lapping controller configured to select groups of sliders randomly. ### Claim 20 (depends on 17) The system of claim 17, further comprising the lapping system configured to lap each group more than once. ### Claim 21 (depends on 17) The system of claim 17, wherein the lapping controller is configured to reselect groups of sliders on subsequent lappings. ### Claim 22 (depends on 15) The system of claim 15, wherein the lapping controller is configured to adjust lapping for more than one slider based on measurement at one of the ELGs.