# US 2014/0154866 A1 · Method of Forming a Semiconductor Memory Device

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- Number: US 2014/0154866 A1
- Document ID: US20140154866A1
- Status: Published application
- Kind: A1
- Application number: 14/173,552
- Filed: 2014-02-05
- Published: 2014-06-05
- Earliest claimed: 2011-02-07
- Assignees: SK hynix Inc.
- Applicants: SK hynix Inc.
- Inventors: Sung Min Hwang; Hyeon Soo Kim
- Web page: https://patentgrep.com/patent/US20140154866A1

## CPC

- H10W 20/01: {Manufacture or treatment}
- H10B 41/35: with a cell select transistor, e.g. NAND
- H10W 10/014: {using trench refilling with dielectric materials, e.g. shallow trench isolations}
- H10W 10/17: formed using trench refilling with dielectric materials, e.g. shallow trench isolations
- H10W 20/072: {of dielectric parts comprising air gaps}
- H10W 20/077: {on sidewalls or on top surfaces of conductors (H10W20/076 takes precedence)}
- H10W 20/46: comprising air gaps
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10B: ELECTRONIC MEMORY DEVICES

## Abstract

A semiconductor memory device includes a semiconductor substrate defining active regions partitioned by an isolation region, conductive lines spaced apart from each other and crossing the active regions over the semiconductor substrate, a thin film pattern formed on a top portion of the conductive lines having opening portions exposing part of the conductive lines in a width wider than a width of the conductive lines, an insulating layer filling the opening portions and formed over the thin film pattern, and an air gap formed between the conductive lines below the insulating layer and the thin film pattern.

## Claims

### Claim 1

A method of forming a semiconductor memory device, comprising:
forming conductive lines spaced apart from each other and crossing active regions that are partitioned by an isolation region over a semiconductor substrate that defines the active regions;
filling a gap-fill layer between the conductive lines;
etching the gap-fill layer to lower a height of the gap-fill layer lower than a top surface of the conductive lines and to expose upper sidewalls of the conductive lines;
forming a thin film pattern having opening portions to expose part of the gap-fill layer on a top surface of the gap-fill layer and on a surface of the conductive lines;
removing remaining portions of the gap-fill layer; and
forming an insulating layer on the thin film pattern to fill the opening portions, thereby forming an air gap between the conductive lines below the insulating layer and the thin film pattern.

### Claim 2 (depends on 1)

The method of claim 1, comprising forming the thin film pattern by:
forming a thin layer on a top surface of the gap-fill layer and on the surface of the conductive lines;
forming a photoresist pattern having opening portions over the thin layer to expose part of the thin layer;
removing the exposed regions of the thin layer using the photoresist pattern as a mask; and
removing the photoresist pattern.

### Claim 3 (depends on 2)

The method of claim 2, comprising removing the photoresist pattern simultaneously with the gap-fill layer.

### Claim 4 (depends on 2)

The method of claim 2, comprising forming the thin film pattern by reducing a width of each of the opening portions of the photoresist pattern by laterally extending the photoresist pattern by applying heat to the photoresist pattern after forming the photoresist pattern.

### Claim 5 (depends on 2)

The method of claim 2, comprising forming the thin film pattern by reducing a width of each of the opening portions of the photoresist pattern by forming a Resolution Enhancement Lithography Assisted by Chemical Shrink (RELACS) material layer that is cross-linked to the photoresist pattern on a surface of the photoresist pattern, after forming the photoresist pattern.

### Claim 6 (depends on 1)

The method of claim 1, wherein the opening portions are overlap the conductive lines and are arranged in parallel diagonally with respect to the conductive lines.

### Claim 7 (depends on 1)

The method of claim 1, wherein each of the opening portions defines an oval.

### Claim 8 (depends on 7)

The method of claim 7, wherein:
a short axis of the oval crosses the conductive lines and is longer than a width of the conductive line and shorter than a pitch between the conductive lines.

### Claim 9 (depends on 1)

The method of claim 1, wherein the gap-fill layer is a Spin-On Carbon (SOC) layer.

### Claim 10 (depends on 1)

The method of claim 1, wherein the thin film pattern is an Ultra Low Temperature Oxide (ULTO) layer.

### Claim 11 (depends on 1)

The method of claim 1, wherein the thin film pattern has a thickness smaller than half a distance between the conductive lines.

### Claim 12

A method of forming a semiconductor memory device, comprising:
forming conductive lines spaced apart from each other and crossing active regions partitioned by an isolation region, over a semiconductor substrate that defines the active regions;
filling a gap-fill layer between the conductive lines;
etching the gap-fill layer to lower a height of the gap-fill layer lower than a top surface of the conductive lines and to expose upper sidewalls of the conductive lines;
forming thin film patterns spaced apart from each other and parallel to the active regions on a top surface of the gap-fill layer and on a surface of the conductive lines to expose the gap-fill layer in a space between the thin film patterns;
removing remaining portions of the gap-fill layer; and
forming an air gap between the conductive lines below each of the thin film patterns by filling the space between the thin film patterns with an insulating layer.

### Claim 13 (depends on 12)

The method of claim 12, comprising forming the thin film patterns by:
forming a thin layer on the top surface of the gap-fill layer and on the surface of the conductive lines;
forming photoresist patterns spaced apart from each other over the thin layer;
removing part of the thin layer exposed between the photoresist patterns; and
removing the photoresist patterns.

### Claim 14 (depends on 13)

The method of claim 13, comprising removing the photoresist patterns simultaneously with the gap-fill layer.

### Claim 15 (depends on 13)

The method of claim 13, comprising forming the thin film patterns by reducing a width of an opening portion between the photoresist patterns by laterally extending each of the photoresist patterns by applying heat to the photoresist patterns after forming the photoresist patterns.

### Claim 16 (depends on 13)

The method of claim 13, comprising forming the thin film patterns by reducing a width of an opening portion between the photoresist patterns by forming a Resolution Enhancement Lithography Assisted by Chemical Shrink (RELACS) material layer cross-linked to the photoresist pattern on a surface of each of the photoresist patterns after forming the photoresist pattern.

### Claim 17 (depends on 12)

The method of claim 12, wherein:
the space between the thin film patterns has a width identical to the width of the isolation region and overlapping the isolation region.

### Claim 18 (depends on 12)

The method of claim 12, wherein the gap-fill layer is a Spin-On Carbon (SOC) layer.

### Claim 19 (depends on 12)

The method of claim 12, wherein each of the thin film patterns is an Ultra Low Temperature Oxide (ULTO) layer.

### Claim 20 (depends on 12)

The method of claim 12, wherein each of the thin film patterns has a thickness smaller than half a distance between the conductive lines.