# US 2014/0154844 A1 · Computer modules with small thicknesses and associated methods of manufacturing

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- Number: US 2014/0154844 A1
- Document ID: US20140154844A1
- Status: Published application
- Kind: A1
- Application number: 14/171,584
- Filed: 2014-02-03
- Published: 2014-06-05
- Earliest claimed: 2009-01-14
- Assignees: Micron Technology, Inc.
- Applicants: Micron Technology, Inc.
- Inventors: Kevin Gibbons; Tracy V. Reynolds; David J. Corisis
- Web page: https://patentgrep.com/patent/US20140154844A1

## CPC

- H10W 90/00: Package configurations
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 7/02: Arrangements of circuit components or wiring on supporting structure
- H10W 72/073: {of die-attach connectors}
- H05K 2201/10515: Stacked components
- H05K 2201/10545: Related components mounted on both sides of the PCB
- H05K 2201/10727: Leadless chip carrier [LCC], e.g. chip-modules for cards
- H05K 2203/1572: Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/20: Configurations of stacked chips
- H10W 90/291: {characterised by containers, encapsulations, or other housings for the stacked chips}
- H10W 90/722: {between stacked chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/49126: Assembling bases
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.

## Claims

### Claim 1

A method for assembling a computer module, comprising:
positioning a microelectronic package proximate to a module substrate having a module material and an aperture extending at least partially into the module material, the microelectronic package having a semiconductor die carried by a package substrate;
generally aligning the semiconductor die of the microelectronic package with the aperture of the module substrate; and
extending at least a portion of the semiconductor die into the substrate material via the aperture.

### Claim 2 (depends on 1)

The method of claim 1 wherein the module substrate includes a bond site on a surface of the module substrate and adjacent to the aperture, and wherein the microelectronic package includes a contact pad electrically coupled to the semiconductor die, and further wherein the method includes generally aligning the contact pad with the bond site.

### Claim 3 (depends on 1)

The method of claim 1 wherein the module substrate includes a bond site on a surface of the module substrate and adjacent to the aperture, and wherein the microelectronic package includes a contact pad electrically coupled to the semiconductor die, and further wherein the method includes:
generally aligning the contact pad with the bond site;
disposing an electric coupler between the contact pad and the bond site; and
electrically coupling the contact pad and the bond site with the electric coupler.