# US 2014/0154838 A1 · Mounting apparatus and mounting method

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- Number: US 2014/0154838 A1
- Document ID: US20140154838A1
- Status: Published application
- Kind: A1
- Application number: 14/096,523
- Filed: 2013-12-04
- Published: 2014-06-05
- Earliest claimed: 2012-12-04
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Yukimori YOSHIAKI; Kajinami MASATO; Ueyama SHINJI
- Web page: https://patentgrep.com/patent/US20140154838A1

## CPC

- H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}
- H10P 72/53: {using optical controlling means}
- H10W 72/0198: {batch processes}
- H10W 90/00: Package configurations
- H10W 72/0711: {Apparatus therefor}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07178: {Means for aligning}
- H10W 72/07223: {Active alignment, e.g. using optical alignment using marks or sensors}
- H10W 72/07232: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In one embodiment the mounting apparatus mounts an upper chip on a lower chip, and thermally presses the upper chip with the lower chip. The mounting apparatus includes a first movement part for mounting the upper chip on the lower chip and preliminarily bonding by thermal pressing, and a second movement part for mainly bonding the plurality of upper chips preliminarily bonded with the plurality of lower chips for a longer time. The second movement part thermally presses the upper chips preliminarily bonded on the lower chip in a state that the upper chips are adsorbed on an adsorption surface parallel to a loading surface of the lower chip on which the upper chips are loaded.

## Claims

### Claim 1

A mounting apparatus for mounting a plurality of semiconductor chips on a connection part on a substrate and bonding the semiconductor chips with the connection part on the substrate by thermal pressing, the mounting apparatus comprising:
a first pressing part for mounting the semiconductor chips on the connection part on the substrate and preliminarily bonding the semiconductor chips with the connection part on the substrate by thermal pressing; and
a second pressing part for mainly bonding the semiconductor chips preliminarily bonded by the first pressing part with the connection part on the substrate by thermal pressing for a time longer than that of the first pressing part,
wherein the second pressing part thermally presses the semiconductor chips preliminarily bonded with the connection part on the substrate in a state that the semiconductor chips are adsorbed on an adsorption surface of the second pressing part to be supported, the adsorption surface being substantially parallel to a loading surface of the substrate on which the semiconductor chips are loaded.

### Claim 2 (depends on 1)

The mounting apparatus of claim 1, wherein the connection part on the substrate is provided on another semiconductor chip bonded with the substrate.

### Claim 3

A mounting method for mounting a plurality of semiconductor chips on a connection part on a substrate and bonding the semiconductor chips with the connection part on the substrate by thermal pressing, the mounting method comprising:
a first pressing process for mounting the semiconductor chips on the connection part on the substrate and preliminarily bonding the semiconductor chips with the connection part on the substrate by thermal pressing of a first pressing part; and
a second pressing process for mainly bonding the semiconductor chips preliminarily bonded by the first pressing process with the connection part on the substrate by thermal pressing of a second processing part for a time longer than that of the first pressing process,
wherein the second pressing process thermally presses the semiconductor chips preliminarily bonded with the connection part on the substrate in a state that the semiconductor chips are adsorbed on an adsorption surface of the second pressing part to be supported, the adsorption surface being substantially parallel to a loading surface of the substrate on which the semiconductor chips are loaded.

### Claim 4 (depends on 3)

The mounting method of claim 3, wherein the connection part on the substrate is provided on another semiconductor chip bonded with the substrate.