# US 2014/0154830 A1 · Image sensor chip package and method for forming the same

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- Number: US 2014/0154830 A1
- Document ID: US20140154830A1
- Status: Published application
- Kind: A1
- Application number: 14/173,526
- Filed: 2014-02-05
- Published: 2014-06-05
- Earliest claimed: 2010-08-26
- Assignees: Xintec Inc.
- Applicants: Xintec Inc
- Inventors: Yu-Lung HUANG; Tzu-Hsiang HUNG; Yen-Shih HO
- Web page: https://patentgrep.com/patent/US20140154830A1

## CPC

- H10F 71/137: {Batch treatment of the devices}
- H10F 39/026: {Wafer-level processing}
- H10F 39/804: {Containers or encapsulations}
- H10W 72/0198: {batch processes}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method for forming an image sensor chip package includes: providing a substrate having predetermined scribe lines defined thereon, wherein the predetermined scribe lines define device regions and each of the device regions has at least a device formed therein; disposing a support substrate on a first surface of the substrate; forming at least a spacer layer between the support substrate and the substrate, wherein the spacer layer covers the predetermined scribe lines; forming a package layer on a second surface of the substrate; forming conducting structures on the second surface of the substrate, wherein the conducting structures are electrically connected to the corresponding device in corresponding one of the device regions, respectively; and dicing along the predetermined scribe lines such that the support substrate is removed from the substrate and the substrate is separated into a plurality of individual image sensor chip packages.

## Claims

### Claim 1

A method for forming an image sensor chip package, comprising:
providing a substrate having a plurality of predetermined scribe lines defined thereon, wherein the predetermined scribe lines define a plurality of device regions in the substrate and each of the device regions has at least a device formed therein;
disposing a support substrate on a first surface of the substrate;
forming at least a spacer layer between the support substrate and the substrate, wherein the spacer layer covers the predetermined scribe lines;
forming a package layer on a second surface of the substrate;
forming a plurality of conducting structures on the second surface of the substrate, wherein the conducting structures are electrically connected to the corresponding device in corresponding one of the device regions, respectively; and
performing a dicing process including dicing the support substrate, the spacer layer, and the substrate along the predetermined scribe lines such that the support substrate is removed from the substrate and the substrate is separated into a plurality of individual image sensor chip packages.

### Claim 2 (depends on 1)

The method for forming an image sensor chip package as claimed in claim 1, wherein the predetermined scribe lines comprise a plurality of first direction predetermined scribe lines substantially parallel to a first direction and a plurality of second direction predetermined scribe lines substantially parallel to a second direction, wherein the first direction is substantially perpendicular to the second direction.

### Claim 3 (depends on 2)

The method for forming an image sensor chip package as claimed in claim 2, wherein the dicing process comprises:
dicing and removing a portion of the support substrate and a portion of the spacer layer covering the first direction predetermined scribe lines from a surface of the support substrate along the first direction predetermined scribe lines;
after the support substrate is partially diced and removed, forming a first fix layer on the surface of the support substrate; and
dicing and removing a portion of the first fix layer, a portion of the support substrate, and a portion of the spacer layer covering the second direction predetermined scribe lines from the surface of the support substrate along the second direction predetermined scribe lines such that the support substrate and the first fix layer are removed from the substrate.

### Claim 4 (depends on 3)

The method for forming an image sensor chip package as claimed in claim 3, further comprising forming a second fix layer on the surface of the support substrate before the dicing process is performed.

### Claim 5 (depends on 3)

The method for forming an image sensor chip package as claimed in claim 3, further comprising disposing a second support substrate on the second surface of the substrate before the dicing process is performed.

### Claim 6 (depends on 5)

The method for forming an image sensor chip package as claimed in claim 5, wherein after the support substrate and the first fix layer are removed from the substrate, the method further comprises dicing and removing a portion of the substrate from the first surface of the substrate along the first direction predetermined scribe lines and the second direction predetermined scribe lines such that the substrate is separated into a plurality of individual image sensor chip packages.

### Claim 7 (depends on 6)

The method for forming an image sensor chip package as claimed in claim 6, further comprising removing the second support substrate.

### Claim 8 (depends on 7)

The method for forming an image sensor chip package as claimed in claim 7, wherein before the second support substrate is removed, the method further comprises attaching a film frame on the separated image sensor chip packages.

### Claim 9 (depends on 1)

The method for forming an image sensor chip package as claimed in claim 1, further comprising thinning the substrate from the second surface of the substrate to a predetermined thickness before the conducting structures are formed.

### Claim 10 (depends on 1)

The method for forming an image sensor chip package as claimed in claim 1, further comprising forming a plurality of through substrate conducting structures in the substrate, wherein the through substrate conducting structures electrically connect corresponding one of the devices and corresponding one of the conducting structures, respectively.

### Claim 11 (depends on 1)

The method for forming an image sensor chip package as claimed in claim 1, further comprising respectively disposing an optical element on the devices in the device regions.

### Claim at position 12

12-18. (canceled)