# US 2014/0154628 A1 · Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0154628 A1 - Document ID: US20140154628A1 - Status: Published application - Kind: A1 - Application number: 14/237,618 - Filed: 2012-08-09 - Published: 2014-06-05 - Earliest claimed: 2011-08-10 - Assignees: Hitachi Chemical Company, Ltd. - Inventors: Toshimasa Nagoshi; Shigeo Tanaka - Web page: https://patentgrep.com/patent/US20140154628A1 ## CPC - G03F 7/0388: {with ethylenic or acetylenic bands in the side chains of the photopolymer} - C08G 59/1455: {Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof} - C08G 59/186: {with acids} - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C08L 63/10: Epoxy resins modified by unsaturated compounds - G03F 7/0047: {characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing} - G03F 7/027: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) - G03F 7/038: Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) - G03F 7/0385: {using epoxidised novolak resin} - H05K 3/287: {Photosensitive compositions} - H05K 2201/0209: Inorganic, non-metallic particles - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The present invention provides a photosensitive resin composition comprising an (a) component: an acid-modified epoxy resin, a (b) component: a photopolymerizable monomer having an ethylenically unsaturated group, a (c) component: a photopolymerization initiator, a (d) component: an epoxy resin, and an (e) component: an inorganic filler, wherein the (a) component comprises an acid-modified bisphenol novolak type epoxy resin and further the photosensitive resin composition satisfies a predetermined condition, and provides a photosensitive film, a permanent resist and a method for producing a permanent resist using the same. ## Claims ### Claim 1 A photosensitive resin composition comprising: an (a) component: an acid-modified epoxy resin; a (b) component: a photopolymerizable monomer having an ethylenically unsaturated group; a (c) component: a photopolymerization initiator; a (d) component: an epoxy resin; and an (e) component: an inorganic filler, wherein the (a) component comprises an acid-modified bisphenol novolak type epoxy resin and further the photosensitive resin composition satisfies at least one of the conditions shown in the following (I) and (II): (I) the (b) component comprises a photopolymerizable monomer having a tricyclodecane structure and a urethane bond; and (II) the (e) component comprises a silica filler having a maximum particle size of 1 μm or less in an amount of more than 60 parts by mass based on a total of 100 parts by mass of the (a) component and the (b) component. ### Claim 2 (depends on 1) The photosensitive resin composition according to claim 1, wherein the acid-modified bisphenol novolak type epoxy resin comprises an acid-modified bisphenol novolak type epoxy resin obtained by adding a polybasic acid anhydride to a product obtained by esterifying an epoxy resin having a structure represented by the following formula (1) with an ethylenically unsaturated group-containing monocarboxylic acid, wherein R1 represents a hydrogen atom or a glycidyl group, R2 represents a hydrogen atom or a methyl group, and n represents 1 or more; in addition, a plurality of R1 and R2 may be the same as or different from each other. ### Claim 3 (depends on 1) The photosensitive resin composition according to claim 1, wherein the photopolymerizable monomer having a tricyclodecane structure and a urethane bond comprises a photopolymerizable monomer having a partial structure represented by the following formula (2) or the following formula (3), wherein R3, R4, R5, and R6 represent a direct bond, an alkylene group, or an arylene group. ### Claim 4 (depends on 1) The photosensitive resin composition according to claim 1, wherein the (b) component comprises a urethane compound obtained by reacting a diol compound having a tricyclodecane structure, a diisocyanate compound, and a compound having an ethylenically unsaturated group and a hydroxyl group. ### Claim 5 (depends on 1) The photosensitive resin composition according to claim 1, further comprising a curing accelerator having an amino group in the molecule. ### Claim 6 (depends on 1) A photosensitive film comprising: a support; and a photosensitive layer formed on the support, the photosensitive layer comprising the photosensitive resin composition according to claim 1. ### Claim 7 (depends on 1) A method for producing a permanent resist comprising: a step of forming a photosensitive layer comprising the photosensitive resin composition according to claim 1 on the substrate; a step of irradiating the photosensitive layer with an active ray in a pattern; and a step of developing the photosensitive layer to form a permanent resist. ### Claim 8 (depends on 1) A permanent resist comprising a cured product of the photosensitive resin composition according to claim 1. ### Claim 9 (depends on 5) A photosensitive film comprising: a support; and a photosensitive layer formed on the support, the photosensitive layer comprising the photosensitive resin composition according to claim 5. ### Claim 10 (depends on 5) A method for producing a permanent resist comprising: a step of forming a photosensitive layer comprising the photosensitive resin composition according to claim 5 on the substrate; a step of irradiating the photosensitive layer with an active ray in a pattern; and a step of developing the photosensitive layer to form a permanent resist. ### Claim 11 (depends on 5) A permanent resist comprising a cured product of the photosensitive resin composition according to claim 5.