# US 2014/0154627 A1 · Negative type photosensitive resin composition, resin film, and electronic device

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- Number: US 2014/0154627 A1
- Document ID: US20140154627A1
- Status: Published application
- Kind: A1
- Application number: 14/233,238
- Filed: 2012-07-19
- Published: 2014-06-05
- Earliest claimed: 2011-07-20
- Assignees: Zeon Corporation
- Inventors: Akihiro Tanabe
- Web page: https://patentgrep.com/patent/US20140154627A1

## CPC

- G03F 7/0757: {Macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence)}
- G03F 7/027: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence)
- G03F 7/035: the binders being polyurethanes
- G03F 7/038: Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021)
- G03F 7/0388: {with ethylenic or acetylenic bands in the side chains of the photopolymer}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

A negative type photosensitive resin composition containing a resin compound (A) which has a weight average molecular weight of 1000 or more, a (meth)acryloyl compound (B), a silane-modified resin (C), a radical-generating type photopolymerization initiator (D), and a silicon atom-free epoxy group-containing cross-linking agent (E), wherein the resin compound (A) contains a resin compound (A1) which has two or more (meth)acryloyl groups in a molecule and which has a carboxyl group which reacts with the epoxy group and the (meth)acryloyl compound (B) has a weight average molecular weight of less than 1000 and has two or more (meth)acryloyl groups in a molecule, is provided.

## Claims

### Claim 1

A negative type photosensitive resin composition containing a resin compound (A) which has a weight average molecular weight of 1000 or more, a (meth)acryloyl compound (B), a silane-modified resin (C), a radical-generating type photopolymerization initiator (D), and a silicon atom-free epoxy group-containing cross-linking agent (E), wherein
said resin compound (A) contains a resin compound (A1) which has two or more (meth)acryloyl groups in a molecule and which has a carboxyl group which reacts with said epoxy group and
said (meth)acryloyl compound (B) has a weight average molecular weight of less than 1000 and has two or more (meth)acryloyl groups in a molecule.

### Claim 2 (depends on 1)

The negative type photosensitive resin composition as set forth in claim 1, wherein said resin compound (A) further contains a resin compound (A2) which has two or more (meth)acryloyl groups in a molecule and does not have a carboxyl group.

### Claim 3 (depends on 1)

The negative type photosensitive resin composition as set forth in claim 1, wherein said resin compound (A) further contains a resin compound (A3) which has two or more (meth)acryloyl groups in a molecule and has a urethane structure.

### Claim 4 (depends on 1)

The negative type photosensitive resin composition as set forth in claim 1, wherein said epoxy group-containing cross-linking agent (E) has a molecular weight of 200 to 550, and a content of said epoxy group-containing cross-linking agent (E) is 30 to 150 parts by weight with respect to 100 parts by weight of said resin compound (A).

### Claim 5 (depends on 1)

The negative type photosensitive resin composition as set forth in claim 1, wherein said epoxy group-containing cross-linking agent (E) is a glycidyl ether compound.

### Claim 6 (depends on 1)

A resin film which is obtained by using the negative type photosensitive resin composition of claim 1.

### Claim 7 (depends on 6)

An electronic device which is provided with a resin film as set forth in claim 6.