# US 2014/0154553 A1 · Solid state power source with frames for attachment to an electronic circuit

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- Number: US 2014/0154553 A1
- Document ID: US20140154553A1
- Status: Published application
- Kind: A1
- Application number: 13/692,729
- Filed: 2012-12-03
- Published: 2014-06-05
- Earliest claimed: 2012-12-03
- Assignees: Infinite Power Solutions, Inc.; Medtronic, Inc.
- Applicants: Medtronic, Inc.
- Inventors: John K. Day; Michael W. Barror; Shawn W. Snyder; Alexandra Z. LaGuardia; Damon E. Lytle; Bernd J. Neudecker
- Web page: https://patentgrep.com/patent/US20140154553A1

## CPC

- H01M 10/0436: {Small-sized flat cells or batteries for portable equipment}
- A61N 1/378: Electrical supply
- H01M 6/181: {with polymeric electrolytes}
- H01M 10/056: characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes
- H01M 10/4257: {Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries}
- H01M 50/103: prismatic or rectangular (H01M50/109, H01M50/11 take precedence)
- H01M 10/0427: {Button cells}
- H01M 10/0486: {Frames for plates or membranes}
- H01M 50/124: having a layered structure
- H01M 50/1245: {characterised by the external coating on the casing}
- H01M 2220/30: Batteries in portable systems, e.g. mobile phone, laptop
- Y02E 60/10: Energy storage using batteries
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10T 428/24331: including nonapertured component
- H01M: PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents A61B; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body A61B18/00; anaesthetic apparatus in general A61M; incandescent lamps H01K; infrared radiators for heating H05B)
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.

## Claims

### Claim 1

A power source for a solid state device, comprising:
a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion;
a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and
a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions,
wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.

### Claim 2 (depends on 1)

The power source for a solid state device according to claim 1, wherein a third portion of the electrolyte layer is positioned between the first pole and the second pole.

### Claim 3 (depends on 1)

The power source for a solid state device according to claim 1, wherein the first contact portion is attached to the first pole layer with a first conductive adhesive layer and the second contact portion is attached to the second pole layer with a second conductive adhesive layer.

### Claim 4 (depends on 1)

The power source for a solid state device according to claim 1, further comprising
a third pole layer, a second electrolyte layer and a fourth pole layer positioned between the first and second contact portions.

### Claim 5 (depends on 1)

The power source for a solid state device according to claim 1, wherein the electrolyte layer, including the first and second portions, encapsulates the first and second poles.

### Claim 6 (depends on 1)

The power source for a solid state device according to claim 1, further comprising:
an electronic circuit, wherein the first bonding portion is electrically and mechanically bonded to the electronic circuit with a first conductive connection adhesive and the second bonding portion is electrically and mechanically bonded to the electronic circuit with a second conductive connection adhesive.

### Claim 7 (depends on 6)

The power source for a solid state device according to claim 6, further comprising
a third frame having a third contact portion, a third bonding portion and a third extension portion between the third contact portion and the third bonding portion;
a fourth frame having a fourth contact portion, a fourth bonding portion and a fourth extension portion between the fourth contact portion and the fourth bonding portion; and
a third pole layer, a second electrolyte layer and a fourth pole layer positioned between the third and fourth contact portions,
wherein the third bonding portion is electrically and mechanically bonded to the electronic circuit with a first conductive connection adhesive and the fourth bonding portion is electrically and mechanically bonded to the electronic circuit with a second conductive connection adhesive.

### Claim 8 (depends on 6)

The power source for a solid state device according to claim 6, wherein the first frame, second frame, first pole layer, electrolyte layer, second pole layer and electronic circuit are hermetically sealed in an enclosure.

### Claim 9

A power source for a solid state device, comprising:
a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion;
a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion;
first and second side encapsulant regions positioned between the first and second contact portions, and
a first pole layer, a first electrolyte layer and a second pole layer positioned between the first and second contact portions, and between the first and second side encapsulant regions.

### Claim 10 (depends on 9)

The power source for a solid state device according to claim 9, wherein the first electrolyte layer is a composite including an electrolyte salt and a first polymer, and the first and second side encapsulant regions include the first polymer.

### Claim 11 (depends on 10)

The power source for a solid state device according to claim 10, further comprising third and fourth side encapsulant regions positioned between the first and second contact portions such that the first, second, third and fourth encapsulant regions encircle the first and second poles.

### Claim 12 (depends on 9)

The power source for a solid state device according to claim 9, wherein the first electrolyte layer is a composite including an electrolyte salt and a first polymer and the first and second side encapsulant regions include a second polymer different than the first polymer.

### Claim 13 (depends on 12)

The power source for a solid state device according to claim 12, further comprising third and fourth side encapsulant regions positioned between the first and second contact portions such that the first, second, third and fourth encapsulant regions encircle the first and second poles.

### Claim 14 (depends on 9)

The power source for a solid state device according to claim 9, wherein the first contact portion is attached to the first pole layer with a first conductive adhesive layer and the second contact portion is attached to the second pole layer with a second conductive adhesive layer.

### Claim 15 (depends on 9)

The power source for a solid state device according to claim 9, further comprising;
a third pole layer, a second electrolyte layer and a fourth pole layer positioned between the first and second contact portions.

### Claim 16 (depends on 9)

The power source for a solid state device according to claim 9, further comprising:
an electronic circuit, wherein the first bonding portion is electrically and mechanically bonded to the electronic circuit with a first conductive connection adhesive and the second bonding portion is electrically and mechanically connected to the electronic circuit with a second conductive connection adhesive.

### Claim 17 (depends on 16)

The power source for a solid state device according to claim 16, further comprising
a third frame having a third contact portion, a third bonding portion and a third extension portion between the third contact portion and the third bonding portion;
a fourth frame having a fourth contact portion, a fourth bonding portion and a fourth extension portion between the fourth contact portion and the fourth bonding portion; and
a third pole layer, a second electrolyte layer and a fourth pole layer positioned between the third and fourth contact portions,
wherein the third bonding portion is electrically and mechanically bonded to the electronic circuit with a third conductive connection adhesive and the fourth bonding portion is electrically and mechanically bonded to the electronic circuit with a forth conductive connection adhesive.

### Claim 18 (depends on 16)

The power source for a solid state device according to claim 16, wherein the first frame, second frame, first side encapsulant region, second encapsulant region, first pole layer, electrolyte layer, second pole layer and electronic circuit are hermetically sealed in an enclosure.

### Claim 19

A power source for a solid state device, comprising:
a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion;
a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion;
a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions; and
an encapsulant between the first and second contact portions,
wherein the first and second bonding portions are aligned in a first direction and the first and second contact portions are aligned in the first direction.

### Claim 20 (depends on 19)

The power source for a solid state device according to claim 19, wherein the first and second extension portions are both aligned in a second direction.

### Claim 21 (depends on 19)

The power source for a solid state device according to claim 19, wherein the first and second bonding portions are in a same plane.

### Claim 22 (depends on 19)

The power source for a solid state device according to claim 19, wherein the electrolyte layer surrounds the first and second poles.

### Claim 23 (depends on 19)

The power source for a solid state device according to claim 19, further comprising first, second, third and fourth side encapsulant regions positioned between the first and second contact portions such that the first, second, third and fourth encapsulant regions surround the first and second poles.

### Claim 24 (depends on 23)

The power source for a solid state device according to claim 23, wherein the electrolyte layer is a composite including an electrolyte salt and a first polymer and the first, second, third and fourth encapsulant regions include said first polymer.

### Claim 25 (depends on 23)

The power source for a solid state device according to claim 23, wherein the electrolyte layer is a composite including an electrolyte salt and a first polymer and the first, second, third and fourth encapsulant regions include a second polymer different than the first polymer.

### Claim 26 (depends on 19)

The power source for a solid state device according to claim 19, wherein the first contact portion is attached to the first pole layer with a first conductive adhesive and the second contact portion is attached to the second pole layer with a second conductive adhesive.

### Claim 27 (depends on 19)

The power source for a solid state device according to claim 19, further comprising
a third pole layer, a second electrolyte layer and a fourth pole layer positioned between the first and second contact portions.

### Claim 28 (depends on 19)

The power source for a solid state device according to claim 19, further comprising:
an electronic circuit, wherein the first bonding portion is electrically and mechanically bonded to the electronic circuit with a first conductive connection adhesive and the second bonding portion is electrically and mechanically bonded to the electronic circuit with a first conductive connection adhesive.

### Claim 29 (depends on 28)

The power source for a solid state device according to claim 28, further comprising
a third frame having a third contact portion, a third bonding portion and a third extension portion between the third contact portion and the third bonding portion;
a fourth frame having a fourth contact portion, a fourth bonding portion and a fourth extension portion between the fourth contact portion and the fourth bonding portion; and
a third pole layer, a second electrolyte layer and a fourth pole layer positioned between the third and fourth contact portions,
wherein the third bonding portion is electrically and mechanically bonded to the electronic circuit and the fourth bonding portion is electrically and mechanically bonded to the electronic circuit.

### Claim 30 (depends on 28)

The power source for a solid state device according to claim 28, wherein the first frame, second frame, first pole layer, electrolyte layer, second pole layer and electronic circuit are hermetically sealed in an enclosure.

### Claim 31

A device, comprising:
a substrate having a first side and a second side;
an electronic circuit on the first side of the substrate;
a first frame and a second frame;
a first side encapsulant region and a second side encapsulant region positioned between the first and second frames;
a first battery having a first pole layer, a first electrolyte layer and a second pole layer positioned between the first and second frames, and between the first and second side encapsulant regions,
wherein the first and second frames electrically and mechanically contact the electronic circuit on the first side of the substrate.

### Claim 32 (depends on 31)

The device according to claim 31, wherein the first electrolyte layer is a composite including an electrolyte salt and a first polymer, and the first and second side encapsulant regions include the first polymer.

### Claim 33 (depends on 32)

The device according to claim 32, further comprising third and fourth side encapsulant regions positioned between the first and second contact portions such that the first, second, third and fourth encapsulant regions encircle the first and second poles.

### Claim 34 (depends on 31)

The device according to claim 31, wherein the first electrolyte layer is a composite including an electrolyte salt and a first polymer and the first and second side encapsulant regions include a second polymer different than the first polymer.

### Claim 35 (depends on 34)

The device according to claim 34, further comprising third and fourth side encapsulant regions positioned between the first and second frames such that the first, second, third and fourth encapsulant regions encircle the first and second poles.

### Claim 36 (depends on 31)

The device according to claim 31, wherein the first frame is attached to the first pole layer with a first conductive adhesive layer and the second frame is attached to the second pole layer with a second conductive adhesive layer.

### Claim 37 (depends on 31)

The device according to claim 31, further comprising;
a hermetic enclosure surrounding the first battery and substrate.

### Claim 38 (depends on 31)

The device according to claim 31, further comprising:
a first conductive connection adhesive electrically and mechanically connecting the first frame to the electronic circuit on the first side of the substrate and a second conductive connection adhesive electrically and mechanically connecting the second frame to the electronic circuit on the first side of the substrate.

### Claim 39 (depends on 31)

The device according to claim 31, further comprising
a second battery having a third pole layer, a second electrolyte layer and a fourth pole layer positioned between third and fourth frames, and between third and fourth side encapsulant regions.

### Claim 40 (depends on 39)

The device according to claim 39, further comprising:
a third conductive connection adhesive electrically and mechanically connecting the third frame to the electronic circuit on the second side of the substrate and a fourth conductive connection adhesive electrically and mechanically connecting the fourth frame to the electronic circuit on the second side of the substrate.