# US 2014/0154490 A1 · Non-combustible film, dispersion liquid for non-combustible films, method for producing non-combustible film, solar cell back sheet, flexible board, and solar cell

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- Number: US 2014/0154490 A1
- Document ID: US20140154490A1
- Status: Published application
- Kind: A1
- Application number: 14/124,539
- Filed: 2012-06-07
- Published: 2014-06-05
- Earliest claimed: 2011-06-09
- Assignees: Sumitomo Seika Chemicals Co., Ltd.; Tokyo University of Science Educational Foundation Administrative Organization; National Institute of Advanced Industrial Science and Technology
- Inventors: Seiji Bando; Noriyuki Hayashizaka; Yuki Umeda; Kazunori Kawasaki; Takeo Ebina; Hiromichi Hayashi; Manabu Yoshida; Takashi Yamashita
- Web page: https://patentgrep.com/patent/US20140154490A1

## CPC

- C08L 79/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- B29C 39/006: {Monomers or prepolymers (by reaction injection moulding B29C67/246)}
- B32B 17/10018: {comprising only one glass sheet}
- B32B 17/10788: {containing ethylene vinylacetate}
- B32B 27/20: using fillers, pigments, thixotroping agents
- B32B 27/281: {comprising polyimides}
- B32B 27/34: comprising polyamides
- C08J 5/18: Manufacture of films or sheets
- C08K 3/22: of metals
- C08K 3/34: Silicon-containing compounds
- C08K 3/346: {Clay}
- C08K 5/20: Carboxylic acid amides
- C08K 5/3415: Five-membered rings
- C08L 79/04: Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- H10F 19/85: Protective back sheets
- B32B 2264/10: Inorganic particles
- B32B 2264/102: Oxide or hydroxide
- B32B 2307/306: Resistant to heat
- B32B 2307/3065: Flame resistant or retardant, fire resistant or retardant
- B32B 2307/7246: Water vapor barrier
- B32B 2379/08: Polyimides
- B32B 2457/08: PCBs, i.e. printed circuit boards
- C08J 2379/04: Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J 2379/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- H05K 2201/012: Flame-retardant; Preventing of inflammation
- H05K 2201/0154: Polyimide
- H05K 2201/0209: Inorganic, non-metallic particles
- Y02E 10/50: Photovoltaic [PV] energy
- Y10T 428/31721: Of polyimide
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention aims to provide a non-combustible film having excellent flexibility, excellent moisture resistance, and high mechanical strength. The present invention also aims to provide a dispersion liquid for non-combustible films which is used in production of the non-combustible film, a method for producing a non-combustible film using the above dispersion, and a solar cell back sheet and a flexible board each of which is formed from the above non-combustible film. The present invention further aims to provide a solar cell including the solar cell back sheet. The non-combustible film of the present invention includes a water-insoluble inorganic compound and a heat-resistant synthetic resin, the water-insoluble inorganic compound constituting from 30% by weight to 90% by weight inclusive of the total weight of the non-combustible film, the film exhibiting a flammability of VTM-0 in the UL-94 VTM test.

## Claims

### Claim 1

A non-combustible film comprising
a water-insoluble inorganic compound and
a heat-resistant synthetic resin,
the water-insoluble inorganic compound constituting from 30% by weight to 90% by weight inclusive of the total weight of the non-combustible film,
the film exhibiting a flammability of VTM-0 in the UL-94 VTM test.

### Claim 2 (depends on 1)

The non-combustible film according to claim 1,
wherein the water-insoluble inorganic compound is at least one selected from the group consisting of silica compounds, silica-alumina compounds, aluminum compounds, calcium compounds, and nitrides.

### Claim 3 (depends on 2)

The non-combustible film according to claim 2,
wherein the water-insoluble inorganic compound is a phyllosilicate mineral.

### Claim 4 (depends on 3)

The non-combustible film according to claim 3,
wherein the phyllosilicate mineral is a non-swelling clay mineral.

### Claim 5 (depends on 4)

The non-combustible film according to claim 4,
wherein the non-swelling clay mineral is at least one selected from the group consisting of talc, kaolin, pyrophyllite, and non-swelling micas.

### Claim 6 (depends on 1)

The non-combustible film according to claim 1,
wherein the heat-resistant synthetic resin is at least one selected from the group consisting of polyimide resins, polyamide-imide resins, and polybenzoxazole resins.

### Claim 7 (depends on 1)

The non-combustible film according to claim 1,
wherein the heat-resistant synthetic resin is at least one selected from the group consisting of aromatic polyimide resins, aromatic polyamide imide resins, and aromatic polybenzoxazole resins.

### Claim 8 (depends on 1)

The non-combustible film according to claim 1,
which is a laminated product obtained by uniting at least two films.

### Claim 9 (depends on 1)

The non-combustible film according to claim 1,
which has a thickness of 10 μm or more.

### Claim 10 (depends on 1)

The non-combustible film according to claim 1,
which has a water vapor permeability of 20 g/m2·day or less at 40° C. and 90% RH.

### Claim 11 (depends on 1)

The non-combustible film according to claim 1,
which cracks in a bend test using a cylindrical mandrel in accordance with JIS-K5600-5-1 (1999) when the diameter of the mandrel is 10 mm or less.

### Claim 12 (depends on 1)

The non-combustible film according to claim 1,
which has a coefficient of linear expansion of 5.0×10−5/° C. or less at from 50° C. to 250° C.

### Claim 13 (depends on 1)

The non-combustible film according to claim 1,
which has non-combustibility defined in a rolling stock material combustion test based on “Ministerial Ordinance to Provide the Technical Standard on Railway”, the Ministerial Ordinance No. 151 promulgated by the Ministry of Land, Infrastructure, Transport and Tourism.

### Claim 14 (depends on 1)

The non-combustible film according to claim 1,
which has, in a heat release test using a cone calorimeter in accordance with ISO 5660-1,
a total heat release from the area of the sample over 20 minutes from the start of heating of 8 MJ/m2 or less,
a maximum heat release rate from the area of the sample over 20 minutes from the start of heating of 300 kW/m2 or less, and
a time from the start of the test to the ignition of 60 seconds or more.

### Claim 15 (depends on 1)

The non-combustible film according to claim 1,
which has a thickness of 100 μm or less in the case of exhibiting a flammability of VTM-0 in the UL-94 VTM test.

### Claim 16 (depends on 1)

The non-combustible film according to claim 1,
which has a dielectric breakdown voltage of 20 kV/mm or more.

### Claim 17 (depends on 1)

A dispersion liquid for non-combustible films which is used in production of the non-combustible film according to claim 1,
the dispersion comprising:
a dispersion medium; and
nonvolatile components of a water-insoluble inorganic compound and at least one of a heat-resistant synthetic resin and a precursor of the heat-resistant synthetic resin,
the water-insoluble inorganic compound constituting from 30% by weight to 90% by weight inclusive of the total weight of the nonvolatile components,
the nonvolatile components constituting more than 18% by weight and 65% by weight or less of the total weight of the dispersion liquid for non-combustible films.

### Claim 18 (depends on 17)

The dispersion liquid for non-combustible films according to claim 17,
wherein the dispersion medium is at least one selected from the group consisting of N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfoxide, tetrahydrofuran, and sulfolane.

### Claim 19 (depends on 17)

A method for producing a non-combustible film, comprising:
a step 1 of preparing the dispersion liquid for non-combustible films according to claim 17;
a step 2 of spreading the prepared dispersion liquid on a substrate and allowing the substrate to stand; and
a step 3 of removing the dispersion medium from the dispersion liquid spread on the substrate to form a film, and removing the film from the substrate.

### Claim 20 (depends on 19)

The method according to claim 19,
wherein the step 2 is performed with the dispersion liquid spread to a thickness of 50 μm or more on the substrate.

### Claim 21 (depends on 19)

The method according to claim 19,
wherein the step 3 is performed with a temperature for removing the dispersion medium of 150° C. or less.

### Claim 22 (depends on 19)

The method according to claim 19,
wherein the substrate is made of glass, polyethylene terephthalate, polyimide, polyethylene, or polypropylene.

### Claim 23 (depends on 1)

A solar cell back sheet,
which is formed from the non-combustible film according to claim 1.

### Claim 24 (depends on 23)

A solar cell comprising
the solar cell back sheet according to claim 23.

### Claim 25 (depends on 1)

A flexible board,
which is formed from the non-combustible film according to claim 1.