# US 2014/0154479 A1 · Resin composition for printed circuit board, insulating film, prepreg and printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0154479 A1 - Document ID: US20140154479A1 - Status: Published application - Kind: A1 - Application number: 13/845,032 - Filed: 2013-03-17 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Geum Hee Yun; Jin Ho Hong; Sa Yong Lee; Jin Young Kim; Keun Yong Lee - Web page: https://patentgrep.com/patent/US20140154479A1 ## CPC - H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)} - H01B 3/40: epoxy resins - H05K 2201/0141: Liquid crystal polymer [LCP] - H05K 2201/0162: Silicon containing polymer, e.g. silicone - H05K 2201/0209: Inorganic, non-metallic particles - H05K 2201/0239: Coupling agent for particles - Y10T 428/24802: Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature. ## Claims ### Claim 1 A resin composition for a printed circuit board, comprising: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. ### Claim 2 (depends on 1) The resin composition of claim 1, wherein the liquid crystalline oligomer is represented by Formula 1, 2, 3 or 4 below: wherein a is an integer of 13˜26, b is an integer of 13˜26, c is an integer of 9˜21, d is an integer of 10˜30, and e is an integer of 10˜30. ### Claim 3 (depends on 1) The resin composition of claim 1, wherein the epoxy resin is represented by Formula 5 or 6 below: wherein R is an alkyl group of 1˜20 carbon atoms, and n is an integer of 0˜20, ### Claim 4 (depends on 1) The resin composition of claim 1, wherein the resin composition comprises 0.5 to 50 wt % of the liquid crystalline oligomer, 5 to 50 wt % of the epoxy resin, and 40 to 80 wt % of the inorganic filler. ### Claim 5 (depends on 1) The resin composition of claim 1, wherein the liquid crystalline oligomer has a number average molecular weight of 2500 to 6500. ### Claim 6 (depends on 1) The resin composition of claim 1, wherein the epoxy resin is at least one selected from the group consisting of a naphthalene-based epoxy resin, a bisphenol A epoxy resin, a phenol novolac epoxy resin, a cresol novolac epoxy resin, a rubber-modified epoxy resin, and a phosphorus-based epoxy resin. ### Claim 7 (depends on 1) The resin composition of claim 1, wherein the inorganic filler is a reaction product of 100 parts by weight of silica, 0.1 to 20 parts by weight of silane having a vinyl group and an alkoxy group, and 0.1 to 20 parts by weight of vinyl or hydroxyl terminated silicone oil. ### Claim 8 (depends on 1) The resin composition of claim 1, wherein the silane having a vinyl group and an alkoxy group is vinyl tetraethyl silane. ### Claim 9 (depends on 1) The resin composition of claim 1, wherein the vinyl or hydroxyl terminated silicone oil is hydroxy terminated silicone oil, vinyl terminated-vinyl penetrated silicone oil or a mixture thereof. ### Claim 10 (depends on 1) The resin composition of claim 1, further comprising at least one selected from the group consisting of an amide-based curing agent, a polyamine-based curing agent, an acid anhydride curing agent, a phenol novolac curing agent, a polymercaptan curing agent, a tertiary amine curing agent, and an imidazole curing agent. ### Claim 11 (depends on 1) The resin composition of claim 1, further comprising at least one selected from the group consisting of a metal-based curing accelerator, an imidazole-based curing accelerator, and an amine-based curing accelerator. ### Claim 12 (depends on 1) The resin composition of claim 1, further comprising at least one thermoplastic resin selected from the group consisting of a phenoxy resin, a polyimide resin, a polyamide-imide (PAI) resin, a polyether-imide (PEI) resin, a polysulfone (PS) resin, a polyether sulfone (PES) resin, a polyphenylene ether (PPE) resin, a polycarbonate (PC) resin, a polyether ether ketone (PEEK) resin, and a polyester resin. ### Claim 13 (depends on 1) An insulating film formed of the resin composition of claim 1. ### Claim 14 (depends on 1) A prepreg formed by impregnating a substrate with the resin composition of claim 1. ### Claim 15 (depends on 13) A printed circuit board comprising the insulation film of claim 13. ### Claim 16 (depends on 14) A printed circuit board comprising the prepreg of claim 14.