# US 2014/0154473 A1 · Method for producing an electronic component of sandwich-like construction, electronic component, detector element and radiation detector > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0154473 A1 - Document ID: US20140154473A1 - Status: Published application - Kind: A1 - Application number: 14/091,461 - Filed: 2013-11-27 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: Siemens Aktiengesellschaft - Applicants: Siemens Aktiengesellschaft - Inventors: Miguel LABAYEN DE INZA; Markus SICKER; Jan WREGE - Web page: https://patentgrep.com/patent/US20140154473A1 ## CPC - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 7/14: applied in spaced arrangements, e.g. in stripes - G01T 1/16: Measuring radiation intensity (G01T1/29 takes precedence {; self-powered detectors G01T3/006; using an ionisation chamber filled with a liquid or solid, e.g. frozen liquid, dielectric G01T3/008}) - G01T 1/20: with scintillation detectors - H10F 30/29: the devices being sensitive to radiation having very short wavelengths, e.g. X-rays, gamma-rays or corpuscular radiation - B32B 3/30: characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} - Y10T 428/24562: Interlaminar spaces - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - G01T: MEASUREMENT OF NUCLEAR OR X-RADIATION (radiation analysis of materials, mass spectrometry G01N23/00; tubes for determining the presence, intensity, density or energy of radiation or particles H01J47/00) - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method is disclosed for producing an electronic component including at least two functional layers. One of the functional layers has channels, open towards the other functional layer, which run inwards from one edge of the functional layer. Further, an adhesive which contacts the adjacent functional layers is located in at least one of the channels, and a hardening of the adhesive is effected by introducing UV radiation via the channels. Furthermore an electronic component is also disclosed, including at least two adjacent functional layers adhesively bonded together in sandwich-like fashion, wherein at least one of the functional layers has channels which extend inwards from at least one edge of the functional layer and an adhesive hardened by UV radiation is arranged in the channels. A detector element of a radiation detector including such an electronic component and a radiation detector having such a detector element are also disclosed. ## Claims ### Claim 1 A method for producing an electronic component of sandwich-like construction including at least two functional layers to be adhesively bonded together, the method comprising: producing a sandwich-like structure including at least two functional layers, the at least two functional layers including at least partially contacting adjacent surfaces, at least one of the at least two functional layers including channels open towards another of the at least two functional layers, the channels running inwards from at least one edge of the at least one functional layer, wherein a first adhesive, hardenable by UV radiation, is located in at least one of the channels, the first adhesive contacting the adjacent at least two functional layers, and introducing UV radiation via the channels to harden the first adhesive. ### Claim 2 (depends on 1) The method of claim 1, wherein a second, heat hardenable adhesive which contacts the adjacent at least two functional layers is located in at least one of the channels, the method further comprising: carrying out, after the first adhesive has hardened, a heat treatment to harden the second adhesive. ### Claim 3 (depends on 2) The method of claim 2, wherein the at least two channels each have exclusively the first adhesive or exclusively the second adhesive. ### Claim 4 (depends on 2) The method of claim 2, wherein at least one channel has both the first adhesive and the second adhesive. ### Claim 5 (depends on 1) The method of claim 1, wherein the first adhesive is inserted with the aid of an application device as a bead into the channel. ### Claim 6 (depends on 4) The method of claim 4, wherein the first adhesive is inserted with the aid of a multi-chamber application device as parallel beads into the channel. ### Claim 7 (depends on 1) The method of claim 1, wherein the first adhesive is inserted into the channel before the sandwich-like structure including the first functional layer and the second functional layer is formed. ### Claim 8 (depends on 1) The method of claim 1, wherein the first adhesive is inserted into the channel after the sandwich-like structure including the first functional layer and the second functional layer is formed. ### Claim 9 (depends on 8) The method of claim 8, wherein the first adhesive is inserted into the channel with the aid of a needle on an application device. ### Claim 10 (depends on 2) The method of claim 2, wherein more than two functional layers are adhesively bonded with one another, and wherein the hardening of the second adhesive by heat takes place only after all the functional layers have been fixed with the aid of the UV-hardening first adhesive. ### Claim 11 (depends on 1) The method of claim 1, wherein at least one of the following layers from the following list is used as a functional layer: scintillator layer, photosensor layer, readout electronics layer, substrate layer, and carrier layer. ### Claim 12 An electronic component, comprising: at least two adjacent functional layers adhesively bonded together with one another in sandwich-like fashion, wherein the at least two adjacent functional layers are at least partially in direct contact, at least one of the at least two functional layers includes a surface, facing an adjacent one of the at least two functional layers, which forms channels transparent to UV light extending inwards from at least one edge of the at least one of the functional layers; a first adhesive, to bond the at least two functional layers to one another, hardenable by UV radiation, said first adhesive being arranged exclusively in at least one of the channels. ### Claim 13 (depends on 12) The electronic component of claim 12, wherein at least one part of the channels is formed by a depression or an incision into the at least one functional layer. ### Claim 14 (depends on 12) The electronic component of claim 12, wherein at least one part of the channels is formed by elevations on the at least one functional layer. ### Claim 15 (depends on 12) The electronic component of claim 12, wherein the at least one channel includes a mirrored surface. ### Claim 16 (depends on 12) The electronic component of claim 12, wherein at least one channel has a depth reducing inwards from the at least one edge of the at least one functional layer. ### Claim 17 (depends on 12) The electronic component of claim 12, wherein a second adhesive, hardenable by heat, is arranged in at least one channel. ### Claim 18 (depends on 17) The electronic component of claim 17, wherein both the first adhesive and the second adhesive, hardenable by heat, are arranged in at least one channel. ### Claim 19 (depends on 12) The electronic component of claim 12, wherein at least one of the two functional layers adhesively bonded together is taken from the following list of functional layers: scintillator layer, photosensor layer, readout electronics layer, substrate layer, and carrier layer. ### Claim 20 (depends on 12) The electronic component of claim 12, wherein the first functional layer is a readout electronics layer and the second functional layer is a substrate layer, and wherein the channels are arranged in the substrate layer. ### Claim 21 (depends on 20) The electronic component of claim 20, wherein a carrier layer is additionally arranged beneath the substrate layer, and wherein the channels run in at least one of the carrier layer and the substrate layer. ### Claim 22 (depends on 12) The electronic component of claim 12, wherein the electronic component is a component part of a radiation detector. ### Claim 23 (depends on 12) A detector element of a radiation detector, comprising the electronic component of claim 12. ### Claim 24 (depends on 23) A radiation detector, in particular of a CT system, comprising: a plurality of detector elements, at least one of the plurality of detector elements being the detector element of claim 23. ### Claim 25 (depends on 24) A CT system, comprising the radiation detector of claim 24. ### Claim 26 (depends on 1) The method of claim 1, wherein at least one channel has both the first adhesive and a second adhesive. ### Claim 27 (depends on 2) The method of claim 2, wherein at least one of the first adhesive and the second adhesive is inserted with the aid of an application device as a bead into the channel. ### Claim 28 (depends on 27) The method of claim 27, wherein at least one of the first adhesive and the second adhesive is inserted with the aid of a multi-chamber application device as parallel beads into the channel. ### Claim 29 (depends on 2) The method of claim 2, wherein at least one of the first adhesive and the second adhesive is inserted into the channel before the sandwich-like structure including the first functional layer and the second functional layer is formed. ### Claim 30 (depends on 2) The method as claimed in claim 2, wherein at least one of the first adhesive and the second adhesive is inserted into the channel after the sandwich-like structure including the first functional layer and the second functional layer is formed. ### Claim 31 (depends on 30) The method of claim 30, wherein at least one of the first adhesive and the second adhesive is inserted into the channel with the aid of a needle on an application device. ### Claim 32 (depends on 13) The electronic component of claim 13, wherein at least one part of the channels is formed by elevations on the at least one functional layer. ### Claim 33 (depends on 12) The electronic component of claim 12, wherein both the first adhesive and a second adhesive, hardenable by heat, are arranged in at least one channel.