# US 2014/0154465 A1 · Substrate support assembly having a plasma resistant protective layer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0154465 A1 - Document ID: US20140154465A1 - Status: Published application - Kind: A1 - Application number: 14/086,799 - Filed: 2013-11-21 - Published: 2014-06-05 - Earliest claimed: 2012-12-04 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Jennifer Y. Sun; Senh Thach; Biraja P. Kanungo; Vahid Firouzdor - Web page: https://patentgrep.com/patent/US20140154465A1 ## CPC - H10P 72/72: using electrostatic chucks - H10P 72/7614: {characterised by a plurality of individual support members, e.g. support posts or protrusions} - H10P 72/7616: {characterised by a coating, a hardness or a material} - Y10T 156/1041: Subsequent to lamination - Y10T 428/24322: Composite web or sheet - Y10T 428/24997: Of metal-containing material - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer covering an upper surface of the ceramic body, wherein the protective layer comprises at least one of yttrium aluminum garnet (YAG) or a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2. ## Claims ### Claim 1 A substrate support assembly comprising: a ceramic body; a thermally conductive base bonded to a lower surface of the ceramic body; and a protective layer covering an upper surface of the ceramic body, wherein the protective layer comprises at least one of yttrium aluminum garnet (YAG) or a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2. ### Claim 2 (depends on 1) The substrate support assembly of claim 1, wherein the protective layer is an ion assisted deposition (IAD) deposited layer having a porosity below 1%, a thickness of less than 20 microns, and a breakdown voltage of greater than 1000 V/mil. ### Claim 3 (depends on 2) The substrate support assembly of claim 2, wherein the upper surface of the ceramic body is non-roughened. ### Claim 4 (depends on 2) The substrate support assembly of claim 2, wherein the ceramic body comprises a plurality of holes and an upper surface of the ceramic body comprises a plurality of mesas, and wherein the protective layer telegraphs the plurality of mesas and does not plug the plurality of holes. ### Claim 5 (depends on 2) The substrate assembly of claim 2, wherein a curvature over the lower surface of the electrostatic puck is less than 50 micron. ### Claim 6 (depends on 1) The substrate support assembly of claim 1, wherein the protective layer is a plasma coating deposited layer having a thickness of 100-300 microns, a porosity of 2-5% and a breakdown voltage of up to 1200 V/mil. ### Claim 7 (depends on 6) The substrate support assembly of claim 6, wherein the protective layer comprises a plurality of mesas formed on a surface of the protective coating, and wherein the substrate support assembly comprises a plurality of holes that penetrate the protective layer and the ceramic body. ### Claim 8 (depends on 6) The substrate support assembly of claim 6, wherein the upper surface of the ceramic body is roughened. ### Claim 9 (depends on 1) The substrate support assembly of claim 1, wherein the protective layer comprises a bulk sintered ceramic article that is diffusion bonded to the upper surface of the ceramic body via an interface layer. ### Claim 10 (depends on 9) The substrate support assembly of claim 9, wherein the ceramic body comprises Al2O3 and the interface layer comprises Y3Al5O12 (YAG). ### Claim 11 (depends on 9) The substrate support assembly of claim 9, wherein the protective layer comprises a plurality of mesas formed on a surface of the protective coating, and wherein the substrate support assembly comprises a plurality of holes that penetrate the protective layer and the ceramic body. ### Claim 12 A method comprising: providing a ceramic body; bonding a thermally conductive base to a lower surface of the ceramic body; performing an ion assisted deposition (IAD) process or a plasma spray process to deposit a protective layer on the upper surface of the ceramic body, the protective layer comprising at least one of yttrium aluminum garnet (YAG) or a ceramic compound of Y4Al2O9 and a solid-solution of Y2O3—ZrO2; forming a plurality of mesas on at least one of an upper surface of the ceramic body or the protective layer; and forming a plurality of holes in at least one of the ceramic body or the protective layer. ### Claim 13 (depends on 12) The method of claim 12, wherein the IAD process is performed to deposit the protective layer, wherein the plurality of mesas are formed on the upper surface of the ceramic body and the plurality of holes are formed in the ceramic body prior to performing the IAD process, and wherein the protective layer telegraphs the plurality of mesas and does not plug the plurality of holes. ### Claim 14 (depends on 13) The method of claim 13, wherein the protective layer has a porosity below 1%, a thickness of less than 20 microns, and a breakdown voltage of greater than 1000 V/mil. ### Claim 15 (depends on 13) The method of claim 13, wherein the ceramic body is an electrostatic puck, the upper surface of the ceramic body is not roughened prior to performing the IAD process, and a curvature over the lower surface of the electrostatic puck is less than 50 micron after performing the IAD process. ### Claim 16 (depends on 12) The method of claim 12, wherein the plasma spray process is performed to deposit the plasma protective layer, the plurality of mesas are formed on an upper surface of the protective layer and the plurality of holes are formed in the ceramic body and the protective layer, the method further comprising roughening the upper surface of the ceramic body prior to the plasma spray process. ### Claim 17 (depends on 16) The method of claim 16, wherein the protective layer has a thickness of 100-300 microns, a porosity of 2-5% and a breakdown voltage of up to 1200 V/mil. ### Claim 18 A method comprising: providing a ceramic body; applying a bulk sintered ceramic article to an upper surface of the ceramic body, the bulk sintered ceramic article comprising at least one of yttrium aluminum garnet (YAG) or a ceramic compound of Y4Al2O9 and a solid-solution of Y2O3—ZrO2, wherein the bulk sintered ceramic article acts as a protective layer for the ceramic body; and heating the ceramic body and the bulk sintered ceramic article to form an interface layer between the upper surface of the ceramic body and the bulk sintered ceramic body, wherein the interface layer comprises first elements from the bulk sintered ceramic body that have reacted with second elements from the ceramic body to diffusion bond the ceramic body to the bulk sintered ceramic body; and bonding a thermally conductive base to a lower surface of the ceramic body. ### Claim 19 (depends on 18) The method of claim 18, further comprising: forming a plurality of mesas on an upper surface of the protective layer; and forming a plurality of holes in the ceramic body and the protective layer. ### Claim 20 (depends on 18) The method of claim 18, wherein the ceramic body comprises alumina, and the interface layer comprises Al2O3 and the interface layer comprises Y3Al5O12 (YAG).