# US 2014/0154037 A1 · Method and systems for semiconductor chip pick & transfer and bonding

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- Number: US 2014/0154037 A1
- Document ID: US20140154037A1
- Status: Published application
- Kind: A1
- Application number: 14/123,707
- Filed: 2012-05-31
- Published: 2014-06-05
- Earliest claimed: 2011-06-03
- Assignees: Orion Systems Integration Pte Ltd
- Inventors: Amlan Sen
- Web page: https://patentgrep.com/patent/US20140154037A1

## CPC

- H10P 72/7602: {the wafers being placed on a robot blade or gripped by a gripper for conveyance}
- H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts}
- H10W 72/07178: {Means for aligning}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Various embodiments provide a system for pick and transfer of semiconductor chips. The system comprises: a rotating arm; two pick up heads attached at respective end portions of the rotating arm; and a camera system for inspecting a chip pick-up position in a vertical line of sight configuration. Also, an axis of rotation of the rotating arm is offset from the line of sight. Various embodiments also provide a corresponding method.

## Claims

### Claim 1

A system for pick and transfer of semiconductor chips comprising:
a rotating arm;
two pick up heads attached at respective end portions of the rotating arm; and
a camera system for inspecting a chip pick-up position in a vertical line of sight configuration;
wherein an axis of rotation of the rotating arm is offset from the line of sight.

### Claim 2 (depends on 1)

The system as claimed in claim 1, wherein the pick up heads are angled relative to a longitudinal axis of the rotating arm.

### Claim 3 (depends on 1)

The system as claimed in claim 1, wherein the pick up heads are moveably attached to the rotating arm.

### Claim 4 (depends on 3)

The system as claimed in claim 3, further comprising means for retracting the pick up heads during rotation of the pick up heads away from the chip pick-up position.

### Claim 5 (depends on 4)

The system as claimed in claim 4, wherein the means for retracting comprises a cam for guiding the pick up heads during rotation of the rotating arm.

### Claim 6 (depends on 1)

The system as claimed in claim 1, wherein the camera system comprises a substantially horizontal camera and a reflecting element for achieving the vertical line of sight configuration

### Claim 7

A method for pick and transfer of semiconductor chips, the method comprising:
providing a rotating arm;
providing two pick up heads attached at respective end portions of the rotating arm;
providing a camera system for inspecting a chip pick-up position in a vertical line of sight configuration; and
rotating the rotating arm for pick and transfer of the semiconductor chips, wherein an axis of rotation of the rotating arm is offset from the line of sight.

### Claim at position 8

-56. (canceled)