# US 2014/0153252 A1 · Led lamp and lighting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0153252 A1 - Document ID: US20140153252A1 - Status: Published application - Kind: A1 - Application number: 14/237,178 - Filed: 2012-02-15 - Published: 2014-06-05 - Earliest claimed: 2011-08-12 - Assignees: Panasonic Corporation - Inventors: Satoshi Shida; Kenji Takahashi; Mitsuko Shuto; Masahiro Miki; Hideo Nagai; Takaari Uemoto - Web page: https://patentgrep.com/patent/US20140153252A1 ## CPC - F21K 9/23: Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings - F21V 13/08: the elements being filters or photoluminescent elements and reflectors - F21V 17/101: {permanently, e.g. welding, gluing or riveting} - F21V 29/506: of globes, bowls or cover glasses - F21K 9/60: Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction - F21V 3/02: characterised by the shape - F21V 3/061: {the material being glass} - F21V 3/062: {the material being plastics} - F21V 7/0016: {on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes} - F21V 23/002: {Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm} - F21V 23/006: {the substrate being distinct from the light source holder} - F21V 29/15: Thermal insulation - F21V 29/85: characterised by the material (liquid coolants F21V29/56) - F21Y 2115/10: Light-emitting diodes [LED] - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract An LED lamp has an envelope that includes a globe (30) and a case (50), an interior space of the envelope being divided in two by a mount (20) closing an opening of the globe (30), the lamp containing, in a globe (30) side of the interior space, an LED and, in a case (50) side of the interior space, a circuit unit for causing the LED to emit light. The LED is thermally connected to the mount (20), and the mount (20) and the case (50) are joined to the globe (30) such that, during light emission, at least as much heat from the LED is propagated from the mount (20) to the globe (30) as from the mount (20) to the case (50). ## Claims ### Claim at position 1 1-8. (canceled) ### Claim 9 A lamp having an envelope that includes a globe and a case, an interior space of the envelope being divided in two by a mount closing an opening of the globe, the lamp containing, in a globe side of the interior space, a semiconductor light-emitting element and, in a case side of the interior space, a circuit unit for causing the semiconductor light-emitting element to emit light, wherein the mount is a circular disc having a side face that is at least partially joined to the globe by a first adhesive, an opening end of the globe is connected to the case by a second adhesive, the semiconductor light-emitting element is thermally connected to the mount and spatially separated from the envelope, a surface contact region where a part of the mount and an inner circumferential surface of the globe are joined by the first adhesive is larger than a surface contact region between the mount and the case, and the mount and the case are joined to the globe such that, during light emission, at least as much heat from the semiconductor light-emitting element is propagated from the mount to the globe as from the mount to the case. ### Claim 10 (depends on 9) The lamp of claim 9, wherein the globe is more thermo-conductive than the case. ### Claim 11 (depends on 9) The lamp of claim 9, wherein the case is fitted to an outside surface of an opening end of the globe. ### Claim 12 (depends on 9) The lamp of claim 9, wherein the first adhesive is more thermo-conductive than the case. ### Claim 13 (depends on 9) The lamp of claim 9, wherein the second adhesive is less thermo-conductive than the case. ### Claim 14 (depends on 9) The lamp of claim 9, wherein a heat shield plate is disposed between the mount and the circuit unit. ### Claim 15 (depends on 9) The lamp of claim 9, wherein the contact surface area between the mount and the globe is a total surface area of contact between the side face of the mount and the case, and between the side face of the mount and a reverse face of the mount. ### Claim 16 (depends on 9) A lighting device comprising a lamp and a lighting fixture for mounting and lighting the lamp, wherein the lamp is the lamp of claim 9. ### Claim 17 (depends on 10) The lamp of claim 10, wherein the case is fitted to an outside surface of an opening end of the globe. ### Claim 18 (depends on 17) The lamp of claim 17, wherein the first adhesive is more thermo-conductive than the case. ### Claim 19 (depends on 18) The lamp of claim 18, wherein the second adhesive is less thermo-conductive than the case. ### Claim 20 (depends on 19) The lamp of claim 19, wherein a heat shield plate is disposed between the mount and the circuit unit. ### Claim 21 (depends on 20) The lamp of claim 20, wherein the contact surface area between the mount and the globe is a total surface area of contact between the side face of the mount and the case, and between the side face of the mount and a reverse face of the mount.