# US 2014/0153221 A1 · Printed circuit board, and lighting device and backlight unit including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0153221 A1 - Document ID: US20140153221A1 - Status: Published application - Kind: A1 - Application number: 14/091,755 - Filed: 2013-11-27 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: LG Innotek Co., Ltd. - Applicants: LG Innotek Co., Ltd. - Inventors: Seung Kwon HONG; Hyun Gyu PARK; In Hee CHO; Hyuk Soo LEE - Web page: https://patentgrep.com/patent/US20140153221A1 ## CPC - F21V 19/003: {Fastening of light source holders, e.g. of circuit boards or substrates holding light sources} - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - G02F 1/133612: {Electrical details} - H05K 1/0278: {Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material} - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 2201/0394: Conductor crossing over a hole in the substrate or a gap between two separate substrate parts - H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections - H05K 2201/10106: Light emitting diode [LED] - H05K 2203/302: Bending a rigid substrate; Breaking rigid substrates by bending - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS ## Abstract Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring. ## Claims ### Claim 1 A printed circuit board, comprising: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring. ### Claim 2 (depends on 1) The printed circuit board of claim 1, further comprising a pad part for connecting the light emitting device and the connection wiring. ### Claim 3 (depends on 1) The printed circuit board of claim 1, wherein the wiring is disposed on the second area. ### Claim 4 (depends on 1) The printed circuit board of claim 1, further comprising an insulating substrate formed on the support substrate. ### Claim 5 (depends on 4) The printed circuit board of claim 4, wherein the wiring is formed on the insulating substrate. ### Claim 6 (depends on 1) A lighting device comprising the printed circuit board of claim 1. ### Claim 7 (depends on 1) A backlight unit comprising the printed circuit board of claim 1. ### Claim 8 A printed circuit board, comprising: a support substrate including a first area in which a light emitting device is mount, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a connection wiring connected to the light emitting device and disposed at one side end corresponding to another side end of the first area in which the bending part is formed; and a wiring connected to the connection wiring. ### Claim 9 (depends on 8) The printed circuit board of claim 8, further comprising: a first insulating substrate disposed at the support substrate of one surface of the first area; and a second insulating substrate disposed at the support substrate of another surface of the first area. ### Claim 10 (depends on 9) The printed circuit board of claim 9, wherein the light emitting device is mounted on the first insulating substrate. ### Claim 11 (depends on 9) The printed circuit board of claim 9, further comprising a pad part disposed on the first insulating substrate and for connecting the light emitting device and the connection wiring. ### Claim 12 (depends on 9) The printed circuit board of claim 9, wherein the wiring is disposed on the second insulating substrate. ### Claim 13 (depends on 8) A lighting device comprising the printed circuit board of claim 8. ### Claim 14 (depends on 8) A backlight unit comprising the printed circuit board of claim 8. ### Claim 15 (depends on 2) A lighting device comprising the printed circuit board of claim 2. ### Claim 16 (depends on 3) A lighting device comprising the printed circuit board of claim 3. ### Claim 17 (depends on 4) A lighting device comprising the printed circuit board of claim 4. ### Claim 18 (depends on 5) A lighting device comprising the printed circuit board of claim 5.