# US 2014/0153219 A1 · Cooling System Utilizing Potential Energy > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0153219 A1 - Document ID: US20140153219A1 - Status: Published application - Kind: A1 - Application number: 13/706,130 - Filed: 2012-12-05 - Published: 2014-06-05 - Earliest claimed: 2012-12-05 - Assignees: Avago Technologies General IP (Singapore) Pte. Ltd. - Applicants: Avago Technologies General IP (Singapore) Pte.Ltd. - Inventors: Chuan Hoe Chan; Ju Chin Poh; Kheng Leng Tan - Web page: https://patentgrep.com/patent/US20140153219A1 ## CPC - F04D 33/00: Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type (F04D35/00 takes precedence; hand-held fans A45B) - F21V 29/63: using electrically-powered vibrating means; using ionic wind - F21V 29/76: with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section - H10W 40/43: by flowing gases, e.g. forced air cooling - F21Y 2115/10: Light-emitting diodes [LED] - F28F 3/02: Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) - F04D: NON-POSITIVE-DISPLACEMENT PUMPS (engine fuel-injection pumps F02M; ion pumps H01J41/12; electrodynamic pumps H02K44/02) - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) ## Abstract A cooling system utilizing a potential energy that provides cooling with low power consumption is disclosed. The cooling system may comprise a heat dissipating member, a support structure, a movable assembly, and a coil. In one embodiment, the movable assembly may be configured to oscillate above the heat dissipating member by utilizing induction from the coil and the potential energy to generate air flow that provide cooling on the heat dissipating member. In other embodiments, the movable assembly may be configured to oscillate substantially within the recess of the heat dissipating member. ## Claims ### Claim 1 A cooling system, comprising: a heat dissipating member; a support structure; a movable assembly pivotally coupled with the support structure and arranged adjacent to the heat dissipating member; and a coil inductively coupled with the movable assembly and configured to oscillate the movable assembly such that the movable assembly moves from first position to second position and acquires potential energy at the second position to move back to the first position, wherein the movable assembly is configured to generate a cooling air flow on the heat dissipating member. ### Claim 2 (depends on 1) The cooling system of claim 1, wherein the heat dissipating member comprises a plurality of fins. ### Claim 3 (depends on 1) The cooling system of claim 1, wherein the movable assembly comprises a pendulum assembly. ### Claim 4 (depends on 3) The cooling system of claim 3, wherein the pendulum assembly comprises: a pendulum weight; and an elongated member having first and second opposing extremities, wherein the first extremity of the elongated member is coupled with the support structure, and the pendulum weight is coupled with the second extremity of the elongated member. ### Claim 5 (depends on 3) The cooling system of claim 3, wherein the pendulum assembly comprises: a pendulum weight; and a resilient member having first and second opposing extremities, wherein the first extremity of the resilient member is coupled with the support structure, and the pendulum weight is coupled with the second extremity of the resilient member. ### Claim 6 (depends on 1) The cooling system of claim 1, further comprising a plurality of movable assemblies, wherein the plurality of the movable assemblies are configured in an array to multiply the generation of the cooling air. ### Claim 7 (depends on 1) The cooling system of claim 1, further comprising a sensor, wherein the sensor is configured to detect the presence of the movable assembly. ### Claim 8 (depends on 1) The cooling system of claim 1, further comprising an energy harvesting device configured to collect an otherwise lost form of energy and configured to convert the otherwise lost form of energy to electrical energy, wherein the energy harvesting device is coupled with the coil for transmitting the electrical energy to the coil so as to drive an inductance of the coil. ### Claim 9 (depends on 1) The cooling system of claim 1, further comprising a temperature sensor, wherein the temperature sensor is configured to sense temperature of the heat dissipating member and provide feedback to the coil. ### Claim 10 (depends on 1) The cooling system of claim 1, wherein the heat dissipating member is arranged below the movable assembly. ### Claim 11 (depends on 2) The cooling system of claim 2, wherein the movable assembly is configured to move in a longitudinal direction with respect to a major surface of at least one of the plurality of fins. ### Claim 12 (depends on 2) The cooling system of claim 2, wherein the movable assembly is configured to move in a transverse direction with respect to a major surface of at least one of the plurality of fins. ### Claim 13 (depends on 1) The cooling system of claim 1, wherein the movable assembly is arranged adjacent to a side of the heat dissipating member. ### Claim 14 (depends on 1) The cooling system of claim 1, wherein the cooling system is a portion of an electronic device. ### Claim 15 A cooling system, comprising: a heat dissipating member having a recess extending into the heat dissipating member; a support structure; a movable assembly pivotally coupled with the support structure, wherein the movable assembly is disposed substantially within the recess of the heat dissipating member; and a coil inductively coupled with the movable assembly and configured to oscillate the movable assembly such that the movable assembly moves from first position to second position and acquires potential energy at the second position to move back to the first position, wherein the movable assembly is configured to generate an air flow substantially within the recess of the heat dissipating member. ### Claim 16 (depends on 15) The cooling system of claim 15, wherein the movable assembly comprises a pendulum assembly disposed substantially within the recess of the heat dissipating member. ### Claim 17 (depends on 15) The cooling system of claim 15, wherein the heat dissipating member comprises a plurality of fins and wherein the recess is interposed between a pair of members of the plurality of fins of the heat dissipating member. ### Claim 18 A lighting system comprising: a body; an illuminator disposed within the body; a heat dissipating member coupled with the body for cooling the illuminator disposed within the body; a support structure; a movable assembly pivotally coupled with the support structure and arranged adjacent to the heat dissipating member; and a coil inductively coupled with the movable assembly and configured to oscillate the movable assembly such that the movable assembly moves from a first position to a second position and acquires potential energy at the second position to move back to the first position, wherein the movable assembly is configured to generate an air flow on the heat dissipating member. ### Claim 19 (depends on 18) The lighting system of claim 18, wherein the illuminator comprises a solid state light source. ### Claim 20 (depends on 18) The lighting system of claim 18, wherein the heat dissipating member is interposed between the body and the movable assembly.